Memory module with a circuit providing load isolation and memory domain translation

ABSTRACT

A memory module includes a plurality of memory devices and a circuit. Each memory device has a corresponding load. The circuit is electrically coupled to the plurality of memory devices and is configured to be electrically coupled to a memory controller of a computer system. The circuit selectively isolates one or more of the loads of the memory devices from the computer system. The circuit comprises logic which translates between a system memory domain of the computer system and a physical memory domain of the memory module.

CROSS-REFERENCE TO RELATED APPLICATIONS

The present application is a continuation-in-part of U.S. patentapplication Ser. No. 11/173,175, filed Jul. 1, 2005, which claims thebenefit of U.S. Provisional Application No. 60/588,244, filed Jul. 15,2004 and which is a continuation-in-part of U.S. patent application Ser.No. 11/075,395, filed Mar. 7, 2005, which claims the benefit of U.S.Provisional Application No. 60/550,668, filed Mar. 5, 2004, U.S.Provisional Application No. 60/575,595, filed May 28, 2004, and U.S.Provisional Application No. 60/590,038, filed Jul. 21, 2004. U.S. patentapplication Ser. Nos. 11/173,175 and 11/075,395, and U.S. ProvisionalApplication Nos. 60/588,244, 60/550,668, 60/575,595, and 60/590,038 areeach incorporated in its entirety by reference herein. The presentapplication also claims the benefit of U.S. Provisional Application No.60/645,087, filed Jan. 19, 2005, which is incorporated in its entiretyby reference herein.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates generally to memory modules of a computersystem, and more specifically to devices and methods for improving theperformance, the memory capacity, or both, of memory modules.

2. Description of the Related Art

Certain types of memory modules comprise a plurality of dynamicrandom-access memory (DRAM) devices mounted on a printed circuit board(PCB). These memory modules are typically mounted in a memory slot orsocket of a computer system (e.g., a server system or a personalcomputer) and are accessed by the processor of the computer system.Memory modules typically have a memory configuration with a uniquecombination of rows, columns, and banks which result in a total memorycapacity for the memory module.

For example, a 512-Megabyte memory module (termed a “512-MB” memorymodule, which actually has 2²⁹ or 536,870,912 bytes of capacity) willtypically utilize eight 512-Megabit DRAM devices (each identified as a“512-Mb” DRAM device, each actually having 2²⁹ or 536,870,912 bits ofcapacity). The memory cells (or memory locations) of each 512-Mb DRAMdevice can be arranged in fourbanks, with each bank having an array of2²⁴ (or 16,777,216) memory locations arranged as 2¹³ rows and 2¹¹columns, and with each memory location having a width of 8 bits. SuchDRAM devices with 64M 8-bit-wide memory locations (actually with fourbanks of 2²⁷ or 134,217,728 one-bit memory cells arranged to provide atotal of 2²⁶ or 67,108,864 memory locations with 8 bits each) areidentified as having a “64 Mb×8” or “64M×8-bit” configuration, or ashaving a depth of 64M and a bit width of 8. Furthermore, certaincommercially-available 512-MB memory modules are termed to have a“64M×8-byte” configuration or a “64M×64-bit” configuration with a depthof 64M and a width of 8 bytes or 64 bits.

Similarly, a 1-Gigabyte memory module (termed a “1-GB” memory module,which actually has 2³⁰ or 1,073,741,824 bytes of capacity) can utilizeeight 1-Gigabit DRAM devices (each identified as a “1-Gb” DRAM device,each actually having 2³⁰ or 1,073,741,824 bits of capacity). The memorylocations of each 1-Gb DRAM device can be arranged in four banks, witheach bank having an array of memory locations with 2¹⁴ rows and 2¹¹columns, and with each memory location having a width of 8 bits. SuchDRAM devices with 128M 8-bit-wide memory locations (actually with atotal of 2²⁷ or 134,217,728 memory locations with 8 bits each) areidentified as having a “128 Mb×8” or “128M×8-bit” configuration, or ashaving a depth of 128M and a bit width of 8. Furthermore, certaincommercially-available 1-GB memory modules are identified as having a“128M×8-byte” configuration or a “128M×64-bit” configuration with adepth of 128M and a width of 8 bytes or 64 bits.

The commercially-available 512-MB (64M×8-byte) memory modules and the1-GB (128M×8-byte) memory modules described above are typically used incomputer systems (e.g., personal computers) which perform graphicsapplications since such “×8” configurations are compatible with datamask capabilities often used in such graphics applications. Conversely,memory modules with “×4” configurations are typically used in computersystems such as servers which are not as graphics-intensive. Examples ofsuch commercially available “×4” memory modules include, but are notlimited to, 512-MB (128M×4-byte) memory modules comprising eight 512-Mb(128 Mb×4) memory devices.

The DRAM devices of a memory module are generally arranged as ranks orrows of memory, each rank of memory generally having a bit width. Forexample, a memory module in which each rank of the memory module is 64bits wide is described as having an “×64” organization. Similarly, amemory module having 72-bit-wide ranks is described as having an “×72”organization.

The memory capacity of a memory module increases with the number ofmemory devices. The number of memory devices of a memory module can beincreased by increasing the number of memory devices per rank or byincreasing the number of ranks. For example, a memory module with fourranks has double the memory capacity of a: memory module with two ranksand four times the memory capacity of a memory module with one rank.Rather than referring to the memory capacity of the memory module, incertain circumstances, the memory density of the memory module isreferred to instead.

During operation, the ranks of a memory module are selected or activatedby address and command signals that are received from the processor.Examples of such address and command signals include, but are notlimited to, rank-select signals, also called chip-select signals. Mostcomputer and server systems support one-rank and two-rank memorymodules. By only supporting one-rank and two-rank memory modules, thememory density that can be incorporated in each memory slot is limited.

Various aspects of the design of a memory module impose limitations onthe size of the memory arrays of the memory module. Certain such aspectsare particularly important for memory modules designed to operate athigher frequencies. Examples of such aspects include, but are notlimited to, memory device (e.g., chip) densities, load fan-out, signalintegrity, available rank selects, power dissipation, and thermalprofiles.

SUMMARY OF THE INVENTION

In certain embodiments, a memory module comprises a plurality of memorydevices and a circuit. Each memory device has a corresponding load. Thecircuit is electrically coupled to the plurality of memory devices andis configured to be electrically coupled to a memory controller of acomputer system. The circuit selectively isolates one or more of theloads of the memory devices from the computer system. The circuitcomprises logic which translates between a system memory domain of thecomputer system and a physical memory domain of the memory module.

In certain embodiments, a method of using a memory module with acomputer system is provided. The method comprises providing a memorymodule having a plurality of memory devices and a circuit. The circuitis electrically coupled to the plurality of memory devices. The circuitis configured to be electrically coupled to a computer system. Eachmemory device has a corresponding load. The method further compriseselectrically coupling the memory module to the computer system. Themethod further comprises activating the circuit to selectively isolateat least one of the loads of the memory devices from the computer systemand to translate between a system memory domain of the computer systemand a physical memory domain of the memory module.

In certain embodiments, a memory module is connectable to a computersystem. The memory module comprises a first memory device having a firstdata signal line and a first data strobe signal line. The memory modulefurther comprises a second memory device having a second data signalline and a second data strobe signal line. The memory module furthercomprises a common data signal line connectable to the computer system.The memory module further comprises a device electrically coupled to thefirst data signal line, to the second data signal line, and to thecommon data signal line. The device selectively electrically couples thefirst data signal line to the common data signal line and selectivelyelectrically couples the second data signal line to the common datasignal line. The device comprises logic which translates between asystem memory domain of the computer system and a physical memory domainof the memory module.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 schematically illustrates an example memory module in accordancewith certain embodiments described herein.

FIG. 2 schematically illustrates a circuit diagram of two memory devicesof a conventional memory module.

FIGS. 3A and 3B schematically illustrate example memory modules having acircuit which selectively isolates one or both of the DQ data signallines of the two memory devices from the computer system in accordancewith certain embodiments described herein.

FIGS. 4A and 4B schematically illustrate example memory modules having acircuit which selectively isolates one or both of the DQ data signallines of the two ranks of memory devices from the, computer system inaccordance with certain embodiments described herein.

FIGS. 5A-5D schematically illustrate example memory modules having acircuit comprising a logic element and one or more switches operativelycoupled to the logic element in accordance with certain embodimentsdescribed herein.

FIG. 6A shows an exemplary timing diagram of a gapless read burst for aback-to-back adjacent read condition from one memory device.

FIG. 6B shows an exemplary timing diagram with an extra clock cyclebetween successive read commands issued to different memory devices forsuccessive read accesses from different memory devices.

FIG. 7 shows an exemplary timing diagram in which the last data strobeof memory device “a” collides with the pre-amble time interval of thedata strobe of memory device “b.”

FIGS. 8A-8D schematically illustrate circuit diagrams of example memorymodules comprising a circuit which multiplexes the DQS data strobesignal lines from one another in accordance with certain embodimentsdescribed herein.

FIG. 9A schematically illustrates an example memory module with fourranks of memory devices compatible with certain embodiments describedherein.

FIG. 9B schematically illustrates an example memory module with tworanks of memory devices compatible with certain embodiments describedherein.

FIG. 9C schematically illustrates another example memory module inaccordance with certain embodiments described herein.

FIG. 10A schematically illustrates an exemplary memory module whichdoubles the rank density in accordance with certain embodimentsdescribed herein.

FIG. 10B schematically illustrates an exemplary circuit compatible withembodiments described herein.

FIG. 11A schematically illustrates an exemplary memory module whichdoubles number of ranks in accordance with certain embodiments describedherein.

FIG. 11B schematically illustrates an exemplary circuit compatible withembodiments described herein.

FIG. 12 schematically illustrates an exemplary memory module in which adata strobe (DQS) pin of a first memory device is electrically connectedto a DQS pin of a second memory device while both DQS pins are active.

FIG. 13 is an exemplary timing diagram of the voltages applied to thetwo DQS pins due to non-simultaneous switching.

FIG. 14 schematically illustrates another exemplary memory module inwhich a DQS pin of a first memory device is connected to a DQS pin of asecond memory device.

FIG. 15 schematically illustrates an exemplary memory module inaccordance with certain embodiments described herein.

FIGS. 16A and 16B schematically illustrate a first side and a secondside, respectively, of a memory module with eighteen 64M×4 bit, DDR-1SDRAM FBGA memory devices on each side of a 184-pin glass-epoxy printedcircuit board.

FIGS. 17A and 17B schematically illustrate an exemplary embodiment of amemory module in which a first resistor and a second resistor are usedto reduce the current flow between the first DQS pin and the second DQSpin.

FIG. 18 schematically illustrates another exemplary memory modulecompatible with certain embodiments described herein.

FIG. 19 schematically illustrates a particular embodiment of the memorymodule schematically illustrated by FIG. 18.

DETAILED DESCRIPTION OF EXAMPLE EMBODIMENTS

Load Isolation

FIG. 1 schematically illustrates an example memory module 10 compatiblewith certain embodiments described herein. The memory module 10 isconnectable to a memory controller 20 of a computer system (not shown).The memory module 10 comprises a plurality of memory devices 30, eachmemory device 30 having a corresponding load. The memory module 10further comprises a circuit 40 electrically coupled to the plurality ofmemory devices 30 and configured to be electrically coupled to thememory controller 20 of the computer system. The circuit 40 selectivelyisolates one or more of the loads of the memory devices from thecomputer system. The circuit 40 comprises logic which translates betweena system memory domain of the computer system and a physical memorydomain of the memory module 10.

As used herein, the term “load” is a broad term which includes, withoutlimitation, electrical load, such as capacitive load, inductive load, orimpedance load. As used herein, the term “isolation” is a broad termwhich includes, without limitation, electrical separation of one or morecomponents from another component or from one another. As used herein,the term “circuit” is a broad term which includes,-without limitation,an electrical component or device, or a configuration of electricalcomponents or devices which are electrically or electromagneticallycoupled together (e.g., integrated circuits), to perform specificfunctions.

Various types of memory modules 10 are compatible with embodimentsdescribed herein. For example, memory modules 10 having memorycapacities of 512-MB, 1-GB, 2-GB, 4-GB, 8-GB, as well as othercapacities, are compatible with embodiments described herein. Certainembodiments described herein are applicable to various frequenciesincluding, but not limited to 100 MHz, 200 MHz, 400 MHz, 800 MHz, andabove. In addition, memory modules 10 having widths of 4 bytes, 8 bytes,16 bytes, 32 bytes, or 32 bits, 64 bits, 128 bits, 256 bits, as well asother widths (in bytes or in bits), are compatible with embodimentsdescribed herein. In certain embodiments, the memory module 10 comprisesa printed circuit board on which the memory devices 30 are mounted, aplurality of edge connectors configured to be electrically coupled to acorresponding plurality of contacts of a module slot of the computersystem, and a plurality of electrical conduits which electrically couplethe memory devices 30 to the circuit 40 and which electrically couplethe circuit 40 to the edge connectors. Furthermore, memory modules 10compatible with embodiments described herein include, but are notlimited to, single in-line memory modules (SIMMs), dual in-line memorymodules (DIMMs), small-outline DIMMs (SO-DIMMs), unbuffered DIMMs(UDIMMs), registered DIMMs (RDIMMs), fully-buffered DIMM (FBDIMM),rank-buffered DIMMs (RBDIMMs), mini-DIMMs, and micro-DIMMs.

Memory devices 30 compatible with embodiments described herein include,but are not limited to, random-access memory (RAM), dynamicrandom-access memory (DRAM), synchronous DRAM (SDRAM), anddouble-data-rate DRAM (e.g., SDR, DDR-1, DDR-2, DDR-3). In addition,memory devices 30 having bit widths of 4, 8, 16, 32, as well as otherbit widths, are compatible with embodiments described herein. Memorydevices 30 compatible with embodiments described herein have packagingwhich include, but are not limited to, thin small-outline package(TSOP), ball-grid-array (BGA), fine-pitch BGA (FBGA), micro-BGA (μBGA),mini-BGA (mBGA), and chip-scale packaging (CSP). Memory devices 30compatible with embodiments described herein ale available from a numberof sources, including but not limited to, Samsung Semiconductor, Inc. ofSan Jose, Calif., Infineon Technologies AG of San Jose, Calif., andMicron Technology, Inc. of Boise, Id. Persons skilled in the art canselect appropriate memory devices 30 in accordance with certainembodiments described herein.

In certain embodiments, the plurality of memory devices 30 comprises afirst number of memory devices 30. In certain such embodiments, thecircuit 40 selectively isolates a second number of the memory devices 30from the computer system, with the second number less than the firstnumber.

In certain embodiments, the plurality of memory devices 30 are arrangedin a first number of ranks. For example, in certain embodiments, thememory devices 30 are arranged in two ranks, as schematicallyillustrated by FIG. 1. In other embodiments, the memory devices 30 arearranged in four ranks. Other numbers of ranks of the memory devices 30are also compatible with embodiments described herein.

In certain embodiments, the circuit comprises a logic element selectedfrom a group consisting of: a programmable-logic device (PLD), anapplication-specific integrated circuit (ASIC), a field-programmablegate array (FPGA), a custom-designed semiconductor device, and a complexprogrammable-logic device (CPLD). In certain embodiments, the logicelement of the circuit 40 is a custom device. Sources of logic elementscompatible with embodiments described herein include, but are notlimited to, Lattice Semiconductor Corporation of Hillsboro, Oreg.,Altera Corporation of San Jose, Calif., and Xilinx Incorporated of SanJose, Calif. In certain embodiments, the logic element comprises variousdiscrete electrical elements, while in certain other embodiments, thelogic element comprises one or more integrated circuits.

In certain embodiments, the circuit 40 further comprises one or moreswitches which are operatively coupled to the logic element to receivecontrol signals from the logic element. Examples of switches compatiblewith certain embodiments described herein include, but are not limitedto, field-effect transistor (FET) switches, such as the SN74AUC1G66single bilateral analog switch available from Texas Instruments, Inc. ofDallas, Tex.

FIG. 2 schematically illustrates a circuit diagram of two memory devices30 a, 30 b of a conventional memory module showing the interconnectionsbetween the DQ data signal lines 102 a, 102 b of the memory devices 30 a30 b and the DQS data strobe signal lines 104 a, 104 b of the memorydevices 30 a, 30 b. Each of the memory devices 30 a, 30 b has aplurality of DQ data signal lines and a plurality of DQS data strobesignal lines, however, for simplicity, FIG. 2 only illustrates a singleDQ data signal line and a single DQS data strobe signal line for eachmemory device 30 a, 30 b. The DQ data signal lines 102 a, 102 b and theDQS data strobe signal lines 104 a, 104 b are typically conductivetraces etched on the printed circuit board of the memory module. Asshown in FIG. 2, each of the memory devices 30 a, 30 b has their DQ datasignal lines 102 a, 102 b electrically coupled to a common DQ line 112and their DQS data strobe signal lines 104 a, 104 b electrically coupledto a common DQS line 114. The common DQ line 112 and the common DQS line114 are electrically coupled to the memory controller 20 of the computersystem. Thus, the computer system is exposed to the loads of both memorydevices 30 a, 30 b concurrently.

In certain embodiments, the circuit 40 selectively isolates the loads ofat least some of the memory devices 30 from the computer system. Thecircuit 40 of certain embodiments is configured to present asignificantly reduced load to the computer system. In certainembodiments in which the memory devices 30 are arranged in a pluralityof ranks, the circuit 40 selectively isolates the loads of some (e.g.,one or more) of the ranks of the memory module 10 from the computersystem. In certain other embodiments, the circuit 40 selectivelyisolates the loads of all of the ranks of the memory module 10 from thecomputer system. For example, when a memory module 10 is not beingaccessed by the computer system, the capacitive load on the memorycontroller 20 of the computer system by the memory module 10 can besubstantially reduced to the capacitive load of the circuit 40 of thememory module 10.

As schematically illustrated by FIGS. 3A and 3B, an example memorymodule 10 compatible with certain embodiments described herein comprisesa circuit 40 which selectively isolates one or both of the DQ datasignal lines 102 a, 102 b of the two memory devices 30 a, 30 b from thecommon DQ data signal line 112 coupled to the computer system. Thus, thecircuit 40 selectively allows a DQ data signal to be transmitted fromthe memory controller 20 of the computer system to one or both of the DQdata signal lines 102 a, 102 b. In addition, the circuit 40 selectivelyallows one of a first DQ data signal from the DQ data signal line 102 aof the first memory device 30 a or a second DQ data signal from the DQdata signal line 102 b of the second memory device 30 b to betransmitted to the memory controller 20 via the common DQ data signalline 112 (see, e.g., triangles on the DQ and DQS lines of FIGS. 3A and3B which point towards the memory controller). While various figures ofthe present application denote read operations by use of DQ and DQSlines which have triangles pointing towards the memory controller,certain embodiments described herein are also compatible with writeoperations (e.g., as would be denoted by triangles on the DQ or DQSlines pointing away from the memory controller).

For example, in certain embodiments, the circuit 40 comprises a pair ofswitches 120 a, 120 b on the DQ data signal lines 102 a, 102 b asschematically illustrated by FIG. 3A. Each switch 120 a, 120 b isselectively actuated to selectively electrically couple the DQ datasignal line 102 a to the common DQ signal line 112, the DQ data signalline 102 b to the common DQ signal line 112, or both DQ data signallines 102 a, 102 b to the common DQ signal line 112. In certain otherembodiments, the circuit 40 comprises a switch 120 electrically coupledto both of the DQ data signal lines 102 a, 102 b, as schematicallyillustrated by FIG. 3B. The switch 120 is selectively actuated toselectively electrically couple the DQ data signal line 10 a to thecommon DQ signal line 112, the DQ data signal line 102 b to the commonDQ signal line 112, or both DQ signal lines 102 a, 102 b to the commonDQ signal line 112. Circuits 40 having other configurations of switchesare also compatible with embodiments described herein. While each of thememory devices 30 a, 30 b has a plurality of DQ data signal lines and aplurality of DQS data strobe signal lines, FIGS. 3A and 3B onlyillustrate a single DQ data signal line and a single DQS data strobesignal line for each memory device 30 a, 30 b for simplicity. Theconfigurations schematically illustrated by FIGS. 3A and 3B can beapplied to all of the DQ data signal lines and DQS data strobe signallines of the memory module 10.

In certain embodiments, the circuit 40 selectively isolates the loads ofranks of memory devices 30 from the computer system. As schematicallyillustrated in FIGS. 4A and 4B, example memory modules 10 compatiblewith certain embodiments described herein comprise a first number ofmemory devices 30 arranged in a first number of ranks 32. The memorymodules 10 of FIGS. 4A and 4B comprises two ranks 32 a, 32 b, with eachrank 32 a, 32 b having a corresponding set of DQ data signal lines and acorresponding set of DQS data strobe lines. Other numbers of ranks(e.g., four ranks) of memory devices 30 of the memory module 10 are alsocompatible with certain embodiments described herein. For simplicity,FIGS. 4A and 4B illustrate only a single DQ data signal line and asingle DQS data strobe signal line from each rank 32.

The circuit 40 of FIG. 4A selectively isolates one or more of the DQdata signal lines 102 a, 102 b of the two ranks 32 a, 32 b from thecomputer system. Thus, the circuit 40 selectively allows a DQ datasignal to be transmitted from the memory controller 20 of the computersystem to the memory devices 30 of one or both of the ranks 32 a, 32 bvia the DQ data signal lines 102 a, 102 b. In addition, the circuit 40selectively allows one of a first DQ data signal from the DQ data signalline 102 a of the first rank 32 a and a second DQ data signal from theDQ data signal line 102 b of the second rank 32 b to be transmitted tothe memory controller 20 via the common DQ data signal line 112. Forexample, in certain embodiments, the circuit 40 comprises a pair ofswitches 120 a, 120 b on the DQ data signal lines 102 a, 102 b asschematically illustrated by FIG. 4A. Each switch 120 a, 120 b isselectively actuated to selectively electrically couple the DQ datasignal line 102 a to the common DQ data signal line 112, the DQ datasignal line 102 b to the common DQ data signal line 112, or both DQ datasignal lines 102 a, 102 b to the common DQ data signal line 112. Incertain other embodiments, the circuit 40 comprises a switch 120electrically coupled to both of the DQ data signal lines 102 a, 102 b,as schematically illustrated by FIG. 4B. The switch 120 is selectivelyactuated to selectively electrically couple the DQ data signal line 102a to the common DQ data signal line 112, the DQ data signal line 102 bto the common DQ data signal line 112, or both DQ data signal lines 102a, 102 b to the common DQ data signal line 112. Circuits 40 having otherconfigurations of switches are also compatible with embodimentsdescribed herein.

In the example embodiments schematically illustrated by FIGS. 3A, 3B,4A, and 4B, the circuit 40 comprises a logic element which is integralwith and comprises the switches 120 which are coupled to the DQ datasignal lines and the DQS data strobe signal lines. In certain suchembodiments, each switch 120 comprises a data pathmultiplexer/demultiplexer. In certain other embodiments, the circuit 40comprises a logic element 122 which is a separate component operativelycoupled to the switches 120, as schematically illustrated by FIGS.5A-5D. The one or more switches 120 are operatively coupled to the logicelement 122 to receive control signals from the logic element 122 and toselectively electrically couple one or more data signal lines to acommon data signal line. Example switches compatible with embodimentsdescribed herein include, but are not limited to field-effect transistor(FET) switches, such as the SN74AUC1G66 single bilateral analog switchavailable from Texas Instruments, Inc. of Dallas, Tex. Example logicelements 122 compatible with certain embodiments described hereininclude, but are not limited to, programmable-logic devices (PLD),application-specific integrated circuits (ASIC), field-programmable gatearrays (FPGA), custom-designed semiconductor devices, and complexprogrammable-logic devices (CPLD). Example logic elements 122 areavailable from Lattice Semiconductor Corporation of Hillsboro, Oreg.,Altera Corporation of San Jose, Calif., and Xilinx Incorporated of SanJose, Calif.

In certain embodiments, the load isolation provided by the circuit 40advantageously allows the memory module 10 to present a reduced load(e.g., electrical load, such as capacitive load, inductive load, orimpedance load) to the computer system by selectively switching betweenthe two ranks of memory devices 30 to which it is coupled. This featureis used in certain embodiments in which the load of the memory module 10may otherwise limit the number of ranks or the number of memory devicesper memory module. In certain embodiments, the memory module 10 operatesas having a data path rank buffer which advantageously isolates theranks of memory devices 30 of the memory module 10 from one another,from the ranks on other memory modules, and from the computer system.This data path rank buffer of certain embodiments advantageouslyprovides DQ-DQS paths for each rank or sets of ranks of memory deviceswhich are separate from one another, or which are separate from thememory controller of the computer system. In certain embodiments, theload isolation advantageously diminishes the effects of capacitiveloading, jitter and other sources of noise. In certain embodiments, theload isolation advantageously simplifies various other aspects ofoperation of the memory module 10, including but not limited to,setup-and-hold time, clock skew, package skew, and process, temperature,voltage, and transmission line variations.

For certain memory module applications that utilize multiple ranks ofmemory, increased load on the memory bus can degrade speed performance.In certain embodiments described herein, selectively isolating the loadsof the ranks of memory devices 30 advantageously decreases the load onthe computer system, thereby allowing the computer system (e.g., server)to run faster with improved signal integrity. In certain embodiments,load isolation advantageously provides system memory with reducedelectrical loading, thereby improving the electrical topology to thememory controller 20. In certain such embodiments, the speed and thememory density of the computer system are advantageously increasedwithout sacrificing one for the other.

In certain embodiments, load isolation advantageously increases the sizeof the memory array supported by the memory controller 20 of thecomputer system. The larger memory array has an increased number ofmemory devices 30 and ranks of memory devices 30 of the memory module10, with a corresponding increased number of chip selects. Certainembodiments described herein advantageously provide more system memoryusing fewer chip selects, thereby avoiding the chip select limitation ofthe memory controller.

An exemplary section of Verilog code corresponding to logic compatiblewith a circuit 40 which provides load isolation is listed below inExample 1. The exemplary code of Example 1 corresponds to a circuit 40comprising six FET switches for providing load isolation to DQ and DQSlines.

EXAMPLE 1

//========================== declarations reg rasN_R, casN_R, weN_R;wire actv_cmd_R, pch_cmd_R, pch_all_cmd_R, ap_xfr_cmd_R_R; wirexfr_cmd_R,mrs_cmd,rd_cmd_R;//- - - - - - - - - - - - - - - - - - - - - - - - - DDR 2 FET regbrs0N_R; // registered chip sel reg brs1N_R; // registered chip sel regbrs2N_R; // registered chip sel reg brs3N_R; // registered chip sel wiresel; wire sel_01; wire sel_23; wire rd_R1; wire wr_cmd_R,wr_R1; regrd_R2,rd_R3,rd_R4,rd_R5; reg wr_R2,wr_R3,wr_R4,wr_R5; regenfet1,enfet2,enfet3,enfet4,enfet5,enfet6; wire wr_01_R1,wr_23_R1; regwr_01_R2,wr_01_R3,wr_01_R4; reg wr_23_R2,wr_23_R3,wr_23_R4; wirerodt0_a,rodt0_b; //========================== logic always @(posedgeclk_in) begin brs0N_R <= brs0_in_N; // cs0 brs1N_R <= brs1_in_N; // cs1brs2N_R <= brs2_in_N; // cs2 brs3N_R <= brs3_in_N; // cs3 rasN_R <=brras_in_N ; casN_R <= brcas_in_N ; weN_R <= bwe_in_N ; end assign sel =˜brs0N_R | ˜brs1N_R | ˜brs2N_R | ˜brs3N_R ; assign sel_01 = ˜brs0N_R |˜brs1N_R ; assign sel_23 = ˜brs2N_R | ˜brs3N_R ; assign actv_cmd_R =!rasN_R & casN_R & weN_R; // activate cmd assign pch_cmd_R = !rasN_R &casN_R & !weN_R ; // pchg cmd assign xfr_cmd_R = rasN_R & !casN_R; //xfr cmd assign mrs_cmd = !rasN_R & !casN_R & !weN_R ; // md reg set cmdassign rd_cmd_R = rasN_R & !casN_R & weN_R ; // read cmd assign wr_cmd_R= rasN_R & !casN_R & !weN_R ; // write cmd//------------------------------------- assign  rd_R1 = sel &rd_cmd_R; // rd cmd cyc 1 assign  wr_R1 = sel & wr_cmd_R; // wr cmd cyc1 //---------------------------------------- always @(posedge clk_in)begin rd_R2 <= rd_R1 ; rd_R3 <= rd_R2; rd_R4 <= rd_R3; rd_R5 <= rd_R4;// rd0_o_R6 <= rd0_o_R5; wr_R2 <= wr_R1 ; wr_R3 <= wr_R2; wr_R4 <=wr_R3; wr_R5 <= wr_R4; end //----------------------------------------assign  wr_01_R1 = sel_01 & wr_cmd_R; // wr cmd cyc 1 for cs 2 & cs3assign  wr_23_R1 = sel_23 & wr_cmd_R; // wr cmd cyc 1 for cs 2 & cs3always @(posedge clk_in) begin wr_01_R2 <= wr_01_R1 ; wr_01_R3 <=wr_01_R2; wr_01_R4 <= wr_01_R3; wr_23_R2 <= wr_23_R1 ; wr_23_R3 <=wr_23_R2; wr_23_R4 <= wr_23_R3; end assign  rodt0_ab = (rodt0) // odtcmd from sys | (wr_23_R1) // wr 1st cyc to other rnks (assume singledimm per channel) | (wr_23_R2) // wr 2nd cyc to other rnks (assumesingle dimm per channel) | (wr_23_R3) // wr 3rd cyc to other rnks(assume single dimm per channel) ; assign  rodt1_ab = (rodt1) // odt cmdfrom sys | (wr_01_R1) // wr 1st cyc to other rnks (assume single dimmper channel) | (wr_01_R2) // wr 2nd cyc to other rnks (assume singledimm per channel) | (wr_01_R3) // wr 3rd cyc to other rnks (assumesingle dimm per channel) ; //----------------------------------------always @(posedge clk_in) begin if ( | (rd_R2) // pre-am rd | (rd_R3) //1st cyc of rd brst (cl3) | (rd_R4) // 2nd cyc of rd brst (cl3) | (wr_R1)// pre-am wr | (wr_R2) // wr brst 1st cyc | (wr_R3) // wr brst 2nd cyc ) begin enfet1 <= 1′b1; // enable fet enfet2 <= 1′b1; // enable fetenfet3 <= 1′b1; // enable fet enfet4 <= 1′b1; // enable fet enfet5 <=1′b1; // enable fet enfet6 <= 1′b1; // enable fet end else begin enfet1<= 1′b0; // disable fet enfet2 <= 1′b0; // disable fet enfet3 <= 1′b0;// disable fet enfet4 <= 1′b0; // disable fet enfet5 <= 1′b0; // disablefet enfet6 <= 1′b0; // disable fet end endBack-to-Back Adjacent Read Commands

Due to their source synchronous nature, DDR SDRAM (e.g., DDR1, DDR2,DDR3) memory devices operate with a data transfer protocol whichsurrounds each burst of data strobes with a pre-amble time interval anda post-amble time interval. The pre-amble time interval provides atiming window for the receiving memory device to enable its data capturecircuitry when a known valid level is present on the strobe signal toavoid false triggers of the memory device's capture circuit. Thepost-amble time interval provides extra time after the last strobe forthis data capture to facilitate good signal integrity. In certainembodiments, when the computer system accesses two consecutive bursts ofdata from the same memory device, termed herein as a “back-to-backadjacent read,” the post-amble time interval of the first read commandand the pre-amble time interval of the second read command are skippedby design protocol to increase read efficiency. FIG. 6A shows anexemplary timing diagram of this “gapless” read burst for a back-to-backadjacent read condition from one memory device.

In certain embodiments, when the second read command accesses data froma different memory device than does the first read command, there is atleast one time interval (e.g., clock cycle) inserted between the datastrobes of the two memory devices. This inserted time interval allowsboth read data bursts to occur without the post-amble time interval ofthe first read data burst colliding or otherwise interfering with thepre-amble time interval of the second read data burst. In certainembodiments, the memory controller of the computer system inserts anextra clock cycle between successive read commands issued to differentmemory devices, as shown in the exemplary timing diagram of FIG. 6B forsuccessive read accesses from different memory devices.

In typical computer systems, the memory controller is informed of thememory boundaries between the ranks of memory of the memory module priorto issuing read commands to the memory module. Such memory controllerscan insert wait time intervals or clock cycles to avoid collisions orinterference between back-to-back adjacent read commands which crossmemory device boundaries, which are referred to herein as “BBARX.”

In certain embodiments described herein in which the number of ranks 32of the memory module 10 is doubled or quadrupled, the circuit 40generates a set of output address and command signals so that theselection decoding is transparent to the computer system. However, incertain such embodiments, there are memory device boundaries of whichthe computer system is unaware, so there are occasions in which BBARXoccurs without the cognizance of the memory controller 20 of thecomputer system. As shown in FIG. 7, the last data strobe of memorydevice “a” collides with the pre-amble time interval of the data strobeof memory device “b,” resulting in a “collision window.”

FIGS. 8A-8D schematically illustrate circuit diagrams of example memorymodules 10 comprising a circuit 40 which multiplexes the DQS data strobesignal lines 104 a, 104 b of two ranks 32 a, 32 b from one another inaccordance with certain embodiments described herein. While the DQS datastrobe signal lines 104 a, 104 b of FIGS. 8A-8D correspond to two ranks32 a, 32 b of memory devices 30, in certain other embodiments, thecircuit 40 multiplexes the DQS data strobe signal lines 104 a, 104 bcorresponding to two individual memory devices 30 a, 30 b.

FIG. 8A schematically illustrates a circuit diagram of an exemplarymemory module 10 comprising a circuit 40 in accordance with certainembodiments described herein. In certain embodiments, BBARX collisionsare avoided by a mechanism which electrically isolates the DQS datastrobe signal lines 104 a, 104 b from one another during the transitionfrom the first read data burst of one rank 32 a of memory devices 30 tothe second read data burst of another rank 32 b of memory devices 30.

In certain embodiments, as schematically illustrated by FIG. 8A, thecircuit 40 comprises a first switch 130 a electrically coupled to afirst DQS data strobe signal line 104 a of a first rank 32 a of memorydevices 30 and a second switch 130 b electrically coupled to a secondDQS data strobe signal line 104 b of a second rank 32 b of memorydevices 30. In certain embodiments, the time for switching the firstswitch 130 a and the second switch 130 b is between the two read databursts (e.g., after the last DQS data strobe of the read data burst ofthe first rank 32 a and before the first DQS data strobe of the readdata burst of the second rank 32 b). During the read data burst for thefirst rank 32 a, the first switch 130 a is enabled. After the last DQSdata strobe of the first rank 32 a and before the first DQS data strobeof the second rank 32 b, the first switch 130 a is disabled and thesecond switch 130 b is enabled.

As shown in FIG. 8A, each of the ranks 32 a, 32 b otherwise involved ina BBARX collision have their DQS data strobe signal lines 104 a, 104 bselectively electrically coupled to the common DQS line 114 through thecircuit 40. The circuit 40 of certain embodiments multiplexes the DQSdata strobe signal lines 104 a, 104 b of the two ranks 32 a, 32 b ofmemory devices 30 from one another to avoid a BBARX collision.

In certain embodiments, as schematically illustrated by FIG. 8B, thecircuit 40 comprises a switch 130 which multiplexes the DQS data strobesignal lines 104 a, 104 b from one another. For example, the circuit 40receives a DQS data strobe signal from the common DQS data strobe signalline 114 and selectively transmits the DQS data strobe signal to thefirst DQS data strobe signal line 104 a, to the second DQS data strobesignal line 104 b, or to both DQS data strobe signal lines 104 a, 104 b.As another example, the circuit 40 receives a first DQS data strobesignal from the first rank 32 a of memory devices 30 and a second DQSdata strobe signal from a second rank 32 b of memory devices 30 andselectively switches one of the first and second DQS data strobe signalsto the common DQS data strobe signal line 114.

In certain embodiments, the circuit 40 also provides the load isolationdescribed above in reference to FIGS. 1-5. For example, as schematicallyillustrated by FIG. 8C, the circuit 40 comprises both the switch 120 forthe DQ data signal lines 102 a, 102 b and the switch 130 for the DQSdata strobe signal lines 104 a, 104 b. While in certain embodiments, theswitches 130 are integral with a logic element of the circuit 40, incertain other embodiments, the switches 130 are separate componentswhich are operatively coupled to a logic element 122 of the circuit 40,as schematically illustrated by FIG. 8D. In certain such embodiments,the control and timing of the switch 130 is performed by the circuit 40which is resident on the memory module 10. Example switches 130compatible with embodiments described herein include, but are notlimited to field-effect transistor (FET) switches, such as theSN74AUC1G66 single bilateral analog switch available from TexasInstruments, Inc. of Dallas, Tex., and multiplexers, such as theSN74AUC2G53 2:1 analog multiplexer/demultiplexer available from TexasInstruments, Inc. of Dallas, Tex.

The circuit 40 of certain embodiments controls the isolation of the DQSdata strobe signal lines 104 a, 104 b by monitoring commands received bythe memory module 10 from the computer system and producing “windows” ofoperation whereby the appropriate switches 130 are activated ordeactivated to enable and disable the DQS data strobe signal lines 104a, 104 b to mitigate BBARX collisions. In certain other embodiments, thecircuit 40 monitors the commands received by the memory module 10 fromthe computer system and selectively activates or deactivates theswitches 120 to enable and disable the DQ data signal lines 102 a, 102 bto reduce the load of the memory module 10 on the computer system. Instill other embodiments, the circuit 40 performs both of these functionstogether.

Command Signal Translation

Most high-density memory modules are currently built with 512-Megabit(“512-Mb”) memory devices wherein each memory device has a 64M×8-bitconfiguration. For example, a 1-Gigabyte (“1-GB”) memory module witherror checking capabilities can be fabricated using eighteen such 512-Mbmemory devices. Alternatively, it can be economically advantageous tofabricate a 1-GB memory module using lower-density memory devices anddoubling the number of memory devices used to produce the desired wordwidth. For example, by fabricating a 1-GB memory module using thirty-six256-Mb memory devices with 64M×4-bit configuration, the cost of theresulting 1-GB memory module can be reduced since the unit cost of each256-Mb memory device is typically lower than one-half the unit cost ofeach 512-Mb memory device. The cost savings can be significant, eventhough twice as many 256-Mb memory devices are used in place of the512-Mb memory devices. For example, by using pairs of 512-Mb memorydevices rather than single 1-Gb memory devices, certain embodimentsdescribed herein reduce the cost of the memory module by a factor of upto approximately five.

Market pricing factors for DRAM devices are such that higher-densityDRAM devices (e.g., 1-Gb DRAM devices) are much more than twice theprice of lower-density DRAM devices (e.g., 512-Mb DRAM devices). Inother words, the price per bit ratio of the higher-density DRAM devicesis greater than that of the lower-density DRAM devices. This pricingdifference often lasts for months or even years after the introductionof the higher-density DRAM devices, until volume production factorsreduce the costs of the newer higher-density DRAM devices. Thus, whenthe cost of a higher-density DRAM device is more than the cost of twolower-density DRAM devices, there is an economic incentive for utilizingpairs of the lower-density DRAM devices to replace individualhigher-density DRAM devices.

FIG. 9A schematically illustrates an exemplary memory module 10compatible with certain embodiments described herein. The memory module10 is connectable to a memory controller 20 of a computer system (notshown). The memory module 10 comprises a printed circuit board 210 and aplurality of memory devices 30 coupled to the printed circuit board 210.The plurality-of memory devices 30 has a first number of memory devices30. The memory module 10 further comprises a circuit 40 coupled to theprinted circuit board 210. The circuit 40 receives a set of inputaddress and command signals from the computer system. The set of inputaddress and command signals correspond to a second number of memorydevices 30 smaller than the first number of memory devices 30. Thecircuit 40 generates a set of output address and command signals inresponse to the set of input address and command signals. The set ofoutput address and command signals corresponds to the first number ofmemory devices 30.

In certain embodiments, as schematically illustrated in FIG. 9A, thememory module 10 further comprises a phase-lock loop device 220 coupledto the printed circuit board 210 and a register 230 coupled to theprinted circuit board 210. In certain embodiments, the phase-lock loopdevice 220 and the register 230 are each mounted on the printed circuitboard 210. In response to signals received from the computer system, thephase-lock loop device 220 transmits clock signals to the plurality ofmemory devices 30, the circuit 40, and the register 230. The register230 receives and buffers a plurality of command signals and addresssignals (e.g., bank address signals, row address signals, column addresssignals, gated column address strobe signals, chip-select signals), andtransmits corresponding signals to the appropriate memory devices 30. Incertain embodiments, the register 230 comprises a plurality of registerdevices. While the phase-lock loop device 220, the register 230, and thecircuit 40 are described herein in certain embodiments as being separatecomponents, in certain other embodiments, two or more of the phase-lockloop device 220, the register 230, and the circuit 40 are portions of asingle component. Persons skilled in the art are able to select aphase-lock loop device 220 and a register 230 compatible withembodiments described herein.

In certain embodiments, the memory module 10 further compriseselectrical components which are electrically coupled to one another andare surface-mounted or embedded on the printed circuit board 210. Theseelectrical components can include, but are not limited to, electricalconduits, resistors, capacitors, inductors, and transistors. In certainembodiments, at least some of these electrical components are discrete,while in other certain embodiments, at least some of these electricalcomponents are constituents of one or more integrated circuits.

In certain embodiments, the printed circuit board 210 is mountable in amodule slot of the computer system. The printed circuit board 210 ofcertain such embodiments has a plurality of edge connectionselectrically coupled to corresponding contacts of the module slot and tothe various components of the memory module 10, thereby providingelectrical connections between the computer system and the components ofthe memory module 10.

In certain embodiments, the plurality of memory devices 30 are arrangedin a first number of ranks 32. For example, in certain embodiments, thememory devices 30 are arranged in four ranks 32 a, 32 b, 32 c, 32 d, asschematically illustrated by FIG. 9A. In certain other embodiments, thememory devices 30 are arranged in two ranks 32 a, 32 b, as schematicallyillustrated by FIG. 9B. Other numbers of ranks 32 of the memory devices30 are also compatible with embodiments described herein.

As schematically illustrated by FIGS. 9A and 9B, in certain embodiments,the circuit 40 receives a set of input command signals (e.g., refresh,precharge) and address signals (e.g., bank address signals, row addresssignals, column address signals, gated column address strobe signals,chip-select signals) from the memory controller 20 of the computersystem. In response to the set of input address and command signals, thecircuit 40 generates a set of output address and command signals.

In certain embodiments, the set of output address and command signalscorresponds to a first number of ranks in which the plurality of memorydevices 30 of the memory module 10 are arranged, and the set of inputaddress and command signals corresponds to a second number of ranks permemory module for which the computer system is configured. The secondnumber of ranks in certain embodiments is smaller than the first numberof ranks. For example, in the exemplary embodiment as schematicallyillustrated by FIG. 9A, the first number of ranks is four while thesecond number of ranks is two. In the exemplary embodiment of FIG. 9B,the first number of ranks is two while the second number of ranks isone. Thus, in certain embodiments, even though the memory module 10actually has the first number of ranks of memory devices 30, the memorymodule 10 simulates a virtual memory module by operating as having thesecond number of ranks of memory devices 30. In certain embodiments, thememory module 10 simulates a virtual memory module when the number ofmemory devices 30 of the memory module 10 is larger than the number ofmemory devices 30 per memory module for which the computer system isconfigured to utilize. In certain embodiments, the circuit 40 compriseslogic (e.g., address decoding logic, command decoding logic) whichtranslates between a system memory domain of the computer system and aphysical memory domain of the memory module 10.

In certain embodiments, the computer system is configured for a numberof ranks per memory module which is smaller than the number of ranks inwhich the memory devices 30 of the memory module 10 are arranged. Incertain such embodiments, the computer system is configured for tworanks of memory per memory module (providing two chip-select signalsCS₀, CS₁) and the plurality of memory modules 30 of the memory module 10are arranged in four ranks, as schematically illustrated by FIG. 9A. Incertain other such embodiments, the computer system is configured forone rank of memory per memory module (providing one chip-select signalCS₀) and the plurality of memory modules 30 of the memory module 10 arearranged in two ranks, as schematically illustrated by FIG. 9B.

In the exemplary embodiment schematically illustrated by FIG. 9A, thememory module 10 has four ranks of memory devices 30 and the computersystem is configured for two ranks of memory devices per memory module.The memory module 10 receives row/column address signals or signal bits(A₀-A_(n+1)), bank address signals (BA₀-BA_(m)), chip-select signals(CS₀ and CS₁), and command signals (e.g., refresh, precharge, etc.) fromthe computer system. The A₀-A_(n) row/column address signals arereceived by the register 230, which buffers these address signals andsends these address signals to the appropriate ranks of memory devices30. The circuit 40 receives the two chip-select signals (CS₀-CS₁) andone row/column address signal (A_(n+1)) from the computer system. Boththe circuit 40 and the register 230 receive the bank address signals(BA₀-BA_(m)) and at least one command signal (e.g., refresh, precharge,etc.) from the computer system.

Logic Tables

Table 1 provides a logic table compatible with certain embodimentsdescribed herein for the selection among ranks of memory devices 30using chip-select signals. TABLE 1 State CS₀ CS₁ A_(n+1) Command CS_(0A)CS_(0B) CS_(1A) CS_(1B) 1 0 1 0 Active 0 1 1 1 2 0 1 1 Active 1 0 1 1 30 1 x Active 0 0 1 1 4 1 0 0 Active 1 1 0 1 5 1 0 1 Active 1 1 1 0 6 1 0x Active 1 1 0 0 7 1 1 x x 1 1 1 1Note:1. CS₀, CS₁, CS_(0A), CS_(0B), CS_(1A), and CS_(1B) are active lowsignals.2. A_(n+1) is an active high signal.3. ‘x’ is a Don't Care condition.4. Command involves a number of command signals that define operationssuch as refresh, precharge, and other operations.

In Logic State 1: CS₀ is active low, A_(n+1) is non-active, and Commandis active. Cs_(0A) is pulled low, thereby selecting Rank 0.

In Logic State 2: CS₀ is active low, A_(n+1) is active, and Command isactive. CS_(0B) is pulled low, thereby selecting Rank 1.

In Logic State 3: CS₀ is active low, A_(n+1) is Don't Care, and Commandis active high. CS_(0A) and CS_(0B) are pulled low, thereby selectingRanks 0 and 1.

In Logic State 4: CS₁ is active low, A_(n+1) is non-active, and Commandis active. CS_(1A) is pulled low, thereby selecting Rank 2.

In Logic State 5: CS₁ is active low, A_(n+1) is active, and Command isactive. CS_(1B) is pulled low, thereby selecting Rank 3.

In Logic State 6: CS₁ is active low, A_(n+1) is Don't Care, and Commandis active. CS_(1A) and CS_(1B) are pulled low, thereby selecting Ranks 2and 3.

In Logic State 7: CS₀ and CS₁ are pulled non-active high, whichdeselects all ranks, i.e., CS_(0A), CS_(0B), CS_(1A), and CS_(1B) arepulled high.

The “Command” column of Table 1 represents the various commands that amemory device (e.g., a DRAM device) can execute, examples of whichinclude, but are not limited to, activation, read, write, precharge, andrefresh. In certain embodiments, the command signal is passed through tothe selected rank only (e.g., state 4 of Table 1). In such embodiments,the command signal (e.g., read) is sent to only one memory device or theother memory device so that data is supplied from one memory device at atime. In other embodiments, the command signal is passed through to bothassociated ranks (e.g., state 6 of Table 1). In such embodiments, thecommand signal (e.g., refresh) is sent to both memory devices to ensurethat the memory content of the memory devices remains valid over time.Certain embodiments utilize a logic table such as that of Table 1 tosimulate a single memory device from two memory devices by selecting tworanks concurrently.

Table 2 provides a logic table compatible with certain embodimentsdescribed herein for the selection among ranks of memory devices 30using gated CAS signals. TABLE 2 CS* RAS* CAS* WE* Density Bit A₁₀Command CAS0* CAS1* 1 x x x x x NOP x x 0 1 1 1 x x NOP 1 1 0 0 1 1 0 xACTIVATE 1 1 0 0 1 1 1 x ACTIVATE 1 1 0 1 0 1 0 x READ 0 1 0 1 0 1 1 xREAD 1 0 0 1 0 0 0 x WRITE 0 1 0 1 0 0 1 x WRITE 1 0 0 0 1 0 0 0PRECHARGE 1 1 0 0 1 0 1 0 PRECHARGE 1 1 0 0 1 0 x 1 PRECHARGE 1 1 0 0 00 x x MODE REG SET 0 0 0 0 0 1 x x REFRESH 0 0

In certain embodiments in which the density bit is a row address bit,for read/write commands, the density bit is the value latched during theactivate command for the selected bank.

Serial-Presence-Detect Device

Memory modules typically include a serial-presence detect (SPD) device240 (e.g., an electrically-erasable-programmable read-only memory orEEPROM device) comprising data which characterize various attributes ofthe memory module, including but not limited to, the number of rowaddresses the number of column addresses, the data width of the memorydevices, the number of ranks, the memory density per rank, the number ofmemory devices, and the memory density per memory device. The SPD device240 communicates this data to the basic input/output system (BIOS) ofthe computer system so that the computer system is informed of thememory capacity and the memory configuration available for use and canconfigure the memory controller properly for maximum reliability andperformance.

For example, for a commercially-available 512-MB (64M×8-byte) memorymodule utilizing eight 512-Mb memory devices each with a 64M×8-bitconfiguration, the SPD device contains the following SPD data (inappropriate bit fields of these bytes):

-   -   Byte 3: Defines the number of row address bits in the DRAM        device in the memory module [13 for the 512-Mb memory device].    -   Byte 4: Defines the number of column address bits in the DRAM        device in the memory module [11 for the 512-Mb memory device].    -   Byte 13: Defines the bit width of the primary DRAM device used        in the memory module [8 bits for the 512-Mb (64M×8-bit) memory        device].    -   Byte 14: Defines the bit width of the error checking DRAM device        used in the memory module [8 bits for the 512-Mb (64M×8-bit)        memory device].    -   Byte 17: Defines the number of banks internal to the DRAM device        used in the memory module [4 for the 512-Mb memory device].

In a further example, for a commercially-available 1-GB (128M×8-byte)memory module utilizing eight 1-Gb memory devices each with a 128M×8-bitconfiguration, as described above, the SPD device contains the followingSPD data (in appropriate bit fields of these bytes):

-   -   Byte 3: Defines the number of row address bits in the DRAM        device in the memory module [14 for the 1-Gb memory device].    -   Byte 4: Defines the number of column address bits in the DRAM        device in the memory module [11 for the 1-Gb memory device].    -   Byte 13: Defines the bit width of the primary DRAM device used        in the memory module [8 bits for the 1-Gb (128M×8-bit) memory        device].    -   Byte 14: Defines the bit width of the error checking DRAM device        used in the memory module [8 bits for the 1-Gb (128M×8-bit)        memory device].    -   Byte 17: Defines the number of banks internal to the DRAM device        used in the memory module [4 for the 1-Gb memory device].

In certain embodiments, the SPD device 240 comprises data whichcharacterize the memory module 10 as having fewer ranks of memorydevices than the memory module 10 actually has, with each of these rankshaving more memory density. For example, for a memory module 10compatible with certain embodiments described herein having two ranks ofmemory devices 30, the SPD device 240 comprises data which characterizesthe memory module 10 as having one rank of memory devices with twice thememory density per rank. Similarly, for a memory module 10 compatiblewith certain embodiments described herein having four ranks of memorydevices 30, the SPD device 240 comprises data which characterizes thememory module 10 as having two ranks of memory devices with twice thememory density per rank. In addition, in certain embodiments, the SPDdevice 240 comprises data which characterize the memory module 10 ashaving fewer memory devices than the memory module 10 actually has, witheach of these memory devices having more memory density per memorydevice. For example, for a memory module 10 compatible with certainembodiments described herein, the SPD device 240 comprises data whichcharacterizes the memory module 10 as having one-half the number ofmemory devices that the memory module 10 actually has, with each ofthese memory devices having twice the memory density per memory device.Thus, in certain embodiments, the SPD device 240 informs the computersystem of the larger memory array by reporting a memory device densitythat is a multiple of the memory devices 30 resident on the memorymodule 10. Certain embodiments described herein advantageously do notrequire system level changes to hardware (e.g., the motherboard of thecomputer system) or to software (e.g., the BIOS of the computer system).

FIG. 9C schematically illustrates an exemplary memory module 10 inaccordance with certain embodiments described herein. The memory module10 comprises a pair of substantially identical memory devices 31, 33.Each memory device 31, 33 has a first bit width, a first number of banksof memory locations, a first number of rows of memory locations, and afirst number of columns of memory-locations. The memory module 10further comprises an SPD device 240 comprising data that characterizesthe pair of memory devices 31, 33. The data characterize the pair ofmemory devices 31, 33 as a virtual memory device having a second bitwidth equal to twice the first bit width, a second number of banks ofmemory locations equal to the first number of banks, a second number ofrows of memory locations equal to the first number of rows, and a secondnumber of columns of memory locations equal to the first number ofcolumns.

In certain such embodiments, the SPD device 240 of the memory module 10is programmed to describe the combined pair of lower-density memorydevices 31, 33 as one virtual or pseudo-higher-density memory device. Inan exemplary embodiment, two 512-Mb memory devices, each with a128M×4-bit configuration, are used to simulate one 1-Gb memory devicehaving a 128M×8-bit configuration. The SPD device 240 of the memorymodule 10 is programmed to describe the pair of 512-Mb memory devices asone virtual or pseudo-1-Gb memory device.

For example, to fabricate a 1-GB (128M×8-byte) memory module, sixteen512-Mb (128M×4-bit) memory devices can be used. The sixteen 512-Mb(128M×4-bit) memory devices are combined in eight pairs, with each pairserving as a virtual or pseudo-1-Gb (128M×8-bit) memory device. Incertain such embodiments, the SPD device 240 contains the following SPDdata (in appropriate bit fields of these bytes):

-   -   Byte 3: 13 row address bits.    -   Byte 4: 12 column address bits.    -   Byte 13: 8 bits wide for the primary virtual 1-Gb (128M×8-bit)        memory device.    -   Byte 14: 8 bits wide for the error checking virtual 1-Gb        (128M×8-bit) memory device.    -   Byte 17: 4 banks.

In this exemplary embodiment, bytes 3, 4, and 17 are programmed to havethe same values as they would have for a 512-MB (128M×4-byte) memorymodule utilizing 512-Mb (128M×4-bit) memory devices. However, bytes 13and 14 of the SPD data are programmed to be equal to 8, corresponding tothe bit width of the virtual or pseudo-higher-density 1-Gb (128M×8-bit)memory device, for a total capacity of 1-GB. Thus, the SPD data does notdescribe the actual-lower-density memory devices, but instead describesthe virtual or pseudo-higher-density memory devices. The BIOS accessesthe SPD data and recognizes the memory module as having 4 banks ofmemory locations arranged in 2¹³ rows and 2¹² columns, with each memorylocation having a width of 8 bits rather than 4 bits.

In certain embodiments, when such a memory module 10 is inserted in acomputer system, the computer system's memory controller then providesto the memory module 10 a set of input address and command signals whichcorrespond to the number of ranks or the number of memory devicesreported by the SPD device 240. For example, placing a two-rank memorymodule 10 compatible with certain embodiments described herein in acomputer system compatible with one-rank memory modules, the SPD device240 reports to the computer system that the memory module 10 only hasone rank. The circuit 40 then receives a set of input address andcommand signals corresponding to a single rank from the computersystem's memory controller, and generates and transmits a set of outputaddress and command signals corresponding to two ranks to theappropriate memory devices 30 of the memory module 10.

Similarly, when a two-rank memory module 10 compatible with certainembodiments described herein is placed in a computer system compatiblewith either one- or two-rank memory modules, the SPD device 240 reportsto the computer system that the memory module 10 only has one rank. Thecircuit 40 then receives a set of input address and command signalscorresponding to a single rank from the computer system's memorycontroller, and generates and transmits a set of output address andcommand signals corresponding to two ranks to the appropriate memorydevices 30 of the memory module 10.

Furthermore, a four-rank memory module 10 compatible with certainembodiments described herein simulates a two-rank memory module whetherthe memory module 10 is inserted in a computer system compatible withtwo-rank memory modules or with two- or four-rank memory modules. Thus,by placing a four-rank memory module 10 compatible with certainembodiments described herein in a module slot that is four-rank-ready,the computer system provides four chip-select signals, but the memorymodule 10 only uses two of the chip-select signals.

In certain embodiments, the circuit 40 comprises the SPD device 240which reports the CAS latency (CL) to the memory controller of thecomputer system. The SPD device 240 of certain embodiments reports a CLwhich has one more cycle than does the actual operational CL of thememory array. In certain embodiments, data transfers between the memorycontroller and the memory module are registered for one additional clockcycle by the circuit 40. The additional clock cycle of certainembodiments is added to the transfer time budget with an incrementaloverall CAS latency. This extra cycle of time in certain embodimentsadvantageously provides sufficient time budget to add a buffer whichelectrically isolates the ranks of memory devices 30 from the memorycontroller 20. The buffer of certain embodiments comprises combinatoriallogic, registers, and logic pipelines. In certain embodiments, thebuffer adds a one-clock cycle time delay, which is equivalent to aregistered DIMM, to accomplish the address decoding. The one-cycle timedelay of certain such embodiments provides sufficient time for read andwrite data transfers to provide the functions of the data pathmultiplexer/demultiplexer. Thus, for example, a DDR2 400-MHz memorysystem in accordance with embodiments described herein has an overallCAS latency of four, and uses memory devices with a CAS latency ofthree. In still other embodiments, the SPD device 240 does not utilizethis extra cycle of time.

Memory Density Multiplication

In certain embodiments, two memory devices having a memory density areused to simulate a single memory device having twice the memory density,and an additional address signal bit is used to access the additionalmemory. Similarly, in certain embodiments, two ranks of memory deviceshaving a memory density are used to simulate a single rank of memorydevices having twice the memory density, and an additional addresssignal bit is used to access the additional memory. As used herein, suchsimulations of memory devices or ranks of memory devices are termed as“memory density multiplication,” and the term “density transition bit”is used to refer to the additional address signal bit which is used toaccess the additional memory by selecting which rank of memory devicesis enabled for a read or write transfer operation.

For example, for computer systems which are normally limited to usingmemory modules which have a single rank of 128M×4-bit memory devices,certain embodiments described herein enable the computer system toutilize memory modules which have double the memory (e.g., two ranks of128M×4-bit memory devices). The circuit 40 of certain such embodimentsprovides the logic (e.g., command and address decoding logic) to doublethe number of chip selects, and the SPD device 240 reports a memorydevice density of 256M×4-bit to the computer system.

In certain embodiments utilizing memory density multiplicationembodiments, the memory module 10 can have various types of memorydevices 30 (e.g., DDR1, DDR2, DDR3, and beyond). The circuit 40 ofcertain such embodiments utilizes implied translation logic equationshaving variations depending on whether the density transition bit is arow, column, or internal bank address bit. In addition, the translationlogic equations of certain embodiments vary depending on the type ofmemory module 10 (e.g., UDIMM, RDIMM, FBDIMM, etc.). Furthermore, incertain embodiments, the translation logic equations vary depending onwhether the implementation multiplies memory devices per rank ormultiplies the number of ranks per memory module.

Table 3 A provides the numbers of rows and columns for DDR-1 memorydevices, as specified by JEDEC standard JESD79D, “Double Data Rate (DDR)SDRAM Specification,” published February 2004, and incorporated in itsentirety by reference herein. TABLE 3A 128-Mb 256-Mb 512-Mb 1-Gb Numberof banks 4 4 4 4 Number of row address bits 12 13 13 14 Number of columnaddress bits for 11 11 12 12 “x4”configuration Number of column addressbits for 10 10 11 11 “x8”configuration Number of column address bits for9 9 10 10 “x16”configuration

As described by Table 3A, 512-Mb (128M×4-bit) DRAM devices have 2¹³ rowsand 2¹² columns of memory locations, while 1-Gb (128M×8-bit) DRAMdevices have 2¹⁴ rows and 2¹¹ columns of memory locations. Because ofthe differences in the number of rows and the number of columns for thetwo types of memory devices, complex address translation procedures andstructures would typically be needed to fabricate a 1-GB (128M×8-byte)memory module using sixteen 512-Mb (128M×4-bit) DRAM devices.

Table 3B shows the device configurations as a function of memory densityfor DDR2 memory devices. TABLE 3B Number of Number of Number of PageSize Rows Columns Internal Banks (x4s or x8s) 256 Mb 13 11 4 1 KB 512 Mb14 11 4 1 KB 1 Gb 14 11 8 1 KB 2 Gb 15 11 8 1 KB 4 Gb 16 11 8 1 KB

Table 4 lists the corresponding density transition bit for the densitytransitions between the DDR2 memory densities of Table 3B. TABLE 4Density Transition Density Transition Bit 256 Mb to 512 Mb A₁₃ 512 Mb to1 Gb BA₂ 1 Gb to 2 Gb A₁₄ 2 Gb to 4 Gb A₁₅Other certain embodiments described herein utilize a transition bit toprovide a transition from pairs of physical 4-Gb memory devices tosimulated 8-Gb memory devices.

In an example embodiment, the memory module comprises one or more pairsof 256-Mb memory devices, with each pair simulating a single 512-Mbmemory device. The simulated 512-Mb memory device has four internalbanks while each of the two 256-Mb memory devices has four internalbanks, for a total of eight internal banks for the pair of 256-Mb memorydevices. In certain embodiments, the additional row address bit istranslated by the circuit 40 to the rank selection between each of thetwo 256-Mb memory devices of the pair. Although there are eight totalinternal banks in the rank-converted memory array, the computer systemis only aware of four internal banks. When the memory controlleractivates a row for a selected bank, the circuit 40 activates the samerow for the same bank, but it does so for the selected rank according tothe logic state of the additional row address bit A₁₃.

In another example embodiment, the memory module comprises one or morepairs of 512-Mb memory devices, with each pair simulating a single 1-Gbmemory device. The simulated 1-Gb memory device has eight internal bankswhile each of the two 512-Mb memory devices has four internal banks, fora total of eight internal banks for the pair of 512-Mb memory devices.In certain embodiments, the mapped BA₂ (bank 2) bit is used to selectbetween the two ranks of 512-Mb memory devices to preserve the internalbank geometry expected by the memory controller of the computer system.The state of the BA₂ bit selects the upper or lower set of four banks,as well as the upper and lower 512-Mb rank.

In another example embodiment, the memory module comprises one or morepairs of 1-Gb memory devices, with each pair simulating a single 2-Gbmemory device. Each of the two 1-Gb memory devices has eight internalbanks for a total of sixteen internal banks, while the simulated 2-Gbmemory device has eight internal banks. In certain embodiments, theadditional row address bit translates to the rank selection between thetwo 1-Gb memory devices. Although there are sixteen total internal banksper pair of 1-Gb memory devices in the rank-converted memory array, thememory controller of the computer system is only aware of eight internalbanks. When the memory controller activates a row of a selected bank,the circuit 40 activates the same row for the same bank, but is does sofor the selected rank according to the logic state of the additional rowaddress bit A₁₄.

The circuit 40 of certain embodiments provides substantially all of thetranslation logic used for the decoding (e.g., command and addressdecoding). In certain such embodiments, there is a fully transparentoperational conversion from the “system memory” density domain of thecomputer system to the “physical memory” density domain of the memorymodule 10. In certain embodiments, the logic translation equations areprogrammed in the circuit 40 by hardware, while in certain otherembodiments, the logic translation equations are programmed in thecircuit 40 by software. Examples 1 and 2 provide exemplary sections ofVerilog code compatible with certain embodiments described herein. Asdescribed more fully below, the code of Examples 1 and 2 includes logicto reduce potential problems due to “back-to-back adjacent read commandswhich cross memory device boundaries or “BBARX.” Persons skilled in theart are able to provide additional logic translation equationscompatible with embodiments described herein.

An exemplary section of Verilog code compatible with memory densitymultiplication from 512 Mb to 1 Gb using DDR2 memory devices with theBA₂ density transition bit is listed below in Example 2. The exemplarycode of Example 2 corresponds to a circuit 40 which receives onechip-select signal from the computer system and which generates twochip-select signals.

EXAMPLE 2

always @(posedge clk_in) begin rs0N_R <= rs0_in_N;  // cs0 rasN_R <=ras_in_N; casN_R <= cas_in_N; weN_R <= we_in_N; end // Gated ChipSelects assign pcs0a_1 = (˜rs0_in_N & ˜ras_in_N & ˜cas_in_N) // ref,mdreg set | (˜rs0_in_N & ras_in_N & cas_in_N) // ref exit, pwr dn |(˜rs0_in_N & ˜ras_in_N & cas_in_N & ˜we_in_N & a10_in) // pchg all |(˜rs0_in_N & ˜ras_in_N & cas_in_N & ˜we_in_N & ˜a10_in & ˜ba2_in) //pchg single bnk | (˜rs0_in_N & ˜ras_in_N & cas_in_N & we_in_N   &˜ba2_in) // activate | (˜rs0_in_N & ras_in_N & ˜cas_in_N     & ˜ba2_in)// xfr ; assign pcs0b_1 = (˜rs0_in_N & ˜ras_in_N & ˜cas_in_N) // ref,mdreg set | (˜rs0_in_N & ras_in_N & cas_in_N) // ref exit, pwr dn |(˜rs0_in_N & ˜ras_in_N & cas_in_N & ˜we_in_N & a10_in) // pchg all |(˜rs0_in_N & ˜ras_in_N & cas_in_N & ˜we_in_N & ˜a10_in & ba2_in) // pchgsingle bnk | (˜rs0_in_N & ˜ras_in_N & cas_in_N & we_in_N   & ba2_in) //activate | (˜rs0_in_N & ras_in_N & ˜cas_in_N     & ba2_in) // xfr ;//-------------------------------------  always @(posedge clk_in) begina4_r <= a4_in ; a5_r <= a5_in ; a6_r <= a6_in ; a10_r <= a10_in ; ba0_r<= ba0_in ; ba1_r <= ba1_in ; ba2_r <= ba2_in ; q_mrs_cmd_cyc1 <=q_mrs_cmd ; end////////////////////////////////////////////////////////////////////////// determine the cas latency////////////////////////////////////////////////////////////////////////assign q_mrs_cmd_r = (!rasN_R & !casN_R & !weN_R)  & !rs0N_R  & (!ba0_r& !ba1_r) ; // md reg set cmd always @(posedge clk_in) if (˜reset_N) //lmr cl3 <= 1′b1 ; else if (q_mrs_cmd_cyc1) // load mode reg cmd  begincl3 <= (˜a6_r & a5_r & a4_r ) ;  end always @(posedge clk_in) if(˜reset_N) // reset cl2 <= 1′b0 ; else if (q_mrs_cmd_cyc1) // load modereg cmd  begin cl2 <= (˜a6_r & a5_r & ˜a4_r ) ;  end always @(posedgeclk_in) if (˜reset_N) // reset cl4 <= 1′b0 ; else if (q_mrs_cmd_cyc1) //load mode reg cmd  begin cl4 <= (a6_r & ˜a5_r & ˜a4_r ) ;  end  always@(posedge clk_in) if (˜reset_N) cl5 <= 1′b0 ; else if (q_mrs_cmd_cyc1)// load mode reg cmd  begin cl5 <= (a6_r & ˜a5_r & a4_r ) ;  end assignpre_cyc2_enfet = (wr_cmd_cyc1 & acs_cyc1 & cl3) // wr brst cl3 preamble; assign pre_cyc3_enfet = (rd_cmd_cyc2 & cl3) // rd brst cl3 preamble |(wr_cmd_cyc2 & cl3) // wr brst cl3 1st pair | (wr_cmd_cyc2 & cl4) // wrbrst cl4 preamble ; assign pre_cyc4_enfet = (wr_cmd_cyc3 & cl3) // wrbrst cl3 2nd pair | (wr_cmd_cyc3 & cl4) // wr brst cl4 1st pair |(rd_cmd_cyc3 & cl3) // rd brst cl3 1st pair | (rd_cmd_cyc3 & cl4) // rdbrst cl4 preamble ; assign pre_cyc5_enfet = (rd_cmd_cyc4 & cl3) // rdbrst cl3 2nd pair | (wr_cmd_cyc4 & cl4) // wr brst cl4 2nd pair |(rd_cmd_cyc4 & cl4) // rd brst cl4 1st pair ; // dq assign pre_dq_cyc =pre_cyc2_enfet  | pre_cyc3_enfet  | pre_cyc4_enfet  | pre_cyc5_enfet  ;assign pre_dq_ncyc = enfet_cyc2  | enfet_cyc3  | enfet_cyc4  |enfet_cyc5  ; // dqs assign pre_dqsa_cyc = (pre_cyc2_enfet & ˜ba2_r)  |(pre_cyc3_enfet & ˜ba2_cyc2)  | (pre_cyc4_enfet & ˜ba2_cyc3)  |(pre_cyc5_enfet & ˜ba2_cyc4)  ; assign pre_dqsb_cyc = (pre_cyc2_enfet &ba2_r)  | (pre_cyc3_enfet & ba2_cyc2)  | (pre_cyc4_enfet & ba2_cyc3)  |(pre_cyc5_enfet & ba2_cyc4)  ; assign pre_dqsa_ncyc = (enfet_cyc2 &˜ba2_cyc2)  | (enfet_cyc3 & ˜ba2_cyc3)  | (enfet_cyc4 & ˜ba2_cyc4)  |(enfet_cyc5 & ˜ba2_cyc5)  ; assign pre_dqsb_ncyc = (enfet_cyc2 &ba2_cyc2)  | (enfet_cyc3 & ba2_cyc3)  | (enfet_cyc4 & ba2_cyc4)  |(enfet_cyc5 & ba2_cyc5)  ; always @(posedge clk_in)  begin acs_cyc2 <=acs_cyc1 ;   // cs active ba2_cyc2 <= ba2_r ; ba2_cyc3 <= ba2_cyc2 ;ba2_cyc4 <= ba2_cyc3 ; ba2_cyc5 <= ba2_cyc4 ; rd_cmd_cyc2 <= rd_cmd_cyc1& acs_cyc1; rd_cmd_cyc3 <= rd_cmd_cyc2 ; rd_cmd_cyc4 <= rd_cmd_cyc3 ;rd_cmd_cyc5 <= rd_cmd_cyc4 ; rd_cmd_cyc6 <= rd_cmd_cyc5 ; rd_cmd_cyc7 <=rd_cmd_cyc6 ; wr_cmd_cyc2 <= wr_cmd_cyc1 & acs_cyc1; wr_cmd_cyc3 <=wr_cmd_cyc2 ; wr_cmd_cyc4 <= wr_cmd_cyc3 ; wr_cmd_cyc5 <= wr_cmd_cyc4 ; end  always @(negedge clk_in)  begin dq_ncyc <= dq_cyc; dqs_ncyc_a <=dqs_cyc_a; dqs_ncyc_b <= dqs_cyc_b;  end // DQ FET enables assignenq_fet1 = dq_cyc | dq_ncyc ; assign enq_fet2 = dq_cyc | dq_ncyc ;assign enq_fet3 = dq_cyc | dq_ncyc ; assign enq_fet4 = dq_cyc | dq_ncyc; assign enq_fet5 = dq_cyc | dq_ncyc ; // DQS FET enables assignens_fet1a = dqs_cyc_a | dqs_ncyc_a  ; assign ens_fet2a = dqs_cyc_a |dqs_ncyc_a  ; assign ens_fet3a = dqs_cyc_a | dqs_ncyc_a  ; assignens_fet1b = dqs_cyc_b | dqs_ncyc_b  ; assign ens_fet2b = dqs_cyc_b |dqs_ncyc_b   ; assign ens_fet3b = dqs_cyc_b | dqs_ncyc_b  ;

Another exemplary section of Verilog code compatible with memory densitymultiplication from 256 Mb to 512 Mb using DDR2 memory devices and gatedCAS signals with the row A₁₃ density transition bit is listed below inExample 3. The exemplary code of Example 3 corresponds to a circuit 40which receives one gated CAS signal from the computer system and whichgenerates two gated CAS signals.

EXAMPLE 3

// latched a13 flags cs0, banks 0-3 always @(posedge clk_in) if(actv_cmd_R & ˜rs0N_R & ˜bnk1_R & ˜bnk0_R) // activate begin 1_a13_00 <=a13_r ; end always @(posedge clk_in) if (actv_cmd_R & ˜rs0N_R & ˜bnk1_R& bnk0_R) // activate begin 1_a13_01 <= a13_r ; end always @(posedgeclk_in) if (actv_cmd_R & ˜rs0N_R & bnk1_R & ˜bnk0_R) // activate begin1_a13_10 <= a13_r ; end always @(posedge clk_in) if (actv_cmd_R &˜rs0N_R & bnk1_R & bnk0_R) // activate begin 1_a13_11 <= a13_r ; end //gated cas assign cas_i = ˜(casN_R); assign cas0_o = ( ˜rasN_R & cas_i) |( rasN_R & ˜1_a13_00 & ˜bnk1_R & ˜bnk0_R & cas_i) | ( rasN_R & ˜1_a13_01& ˜bnk1_R & bnk0_R & cas_i) | ( rasN_R & ˜1_a13_10 & bnk1_R & ˜bnk0_R &cas_i) | ( rasN_R & ˜1_a13_11 & bnk1_R & bnk0_R & cas_i) ; assign cas1_o= ( ˜rasN_R & cas_i) | ( rasN_R & 1_a13_00 & ˜bnk1_R & ˜bnk0_R & cas_i)| ( rasN_R & 1_a13_01 & ˜bnk1_R & bnk0_R & cas_i) | ( rasN_R & 1_a13_10& bnk1_R & ˜bnk0_R & cas_i) | ( rasN_R & 1_a13_11 & bnk1_R & bnk0_R &cas_i) ; assign pcas_0_N = ˜cas0_o; assign pcas_1_N = ˜cas1_o; assignrd0_o_R1 = rasN_R & cas0_o & weN_R & ˜rs0N_R; // rnk0 rd cmd cyc assignrd1_o_R1 = rasN_R & cas1_o & weN_R & ˜rs0N_R; // rnk1 rd cmd cyc assignwr0_o_R1 = rasN_R & cas0_o & ˜weN_R & ˜rs0N_R; // rnk0 wr cmd cyc assignwr1_o_R1 = rasN_R & cas1_o & ˜weN_R & ˜rs0N_R ; // rnk1 wr cmd cycalways @(posedge clk_in) begin rd0_o_R2 <= rd0_o_R1 ; rd0_o_R3 <=rd0_o_R2; rd0_o_R4 <= rd0_o_R3; rd0_o_R5 <= rd0_o_R4; rd1_o_R2 <=rd1_o_R1 ; rd1_o_R3 <= rd1_o_R2; rd1_o_R4 <= rd1_o_R3; rd1_o_R5 <=rd1_o_R4; wr0_0_R2 <= wr0_o_R1 ; wr0_o_R3 <= wr0_o_R2; wr0_o_R4 <=wr0_o_R3; wr1_o_R2 <= wr1_o_R1 ; wr1_o_R3 <= wr1_o_R2; wr1_o_R4 <=wr1_o_R3; end always @(posedge clk_in) begin if (  (rd0_o_R2 &˜rd1_o_R4) // pre-am rd if no ped on rnk 1 | rd0_o_R3 // 1st cyc of rdbrst | rd0_o_R4 // 2nd cyc of rd brst | (rd0_o_R5 & ˜rd1_o_R2 &˜rd1_o_R3) // post-rd cyc if no ped on rnk 1 | (wr0_o_R1) // pre-am wr |wr0_o_R2 | wr0_o_R3 // wr brst 1st & 2nd cyc | (wr0_o_R4) // post-wr cyc(chgef9) | wr1_o_R1 | wr1_o_R2 | wr1_o_R3 | wr1_o_R4 // rank 1 (chgef9)) en_fet_a <= 1′b1; // enable fet else en_fet_a <= 1′b0; // disable fetend always @(posedge clk_in) begin if (  (rd1_o_R2 & ˜rd0_o_R4) |rd1_o_R3 | rd1_o_R4 | (rd1_o_R5 & ˜rd0_o_R2 & ˜rd0_o_R3) | (wr1_o_R1) //(chgef8) | wr1_o_R2 | wr1_o_R3 | (wr1_o_R4) // post-wr cyc   (chgef9) |wr0_o_R1 | wr0_o_R2 | wr0_o_R3 | wr0_o_R4 // rank 0 (chgef9) ) en_fet_b<= 1′b1; // else en_fet_b <= 1′b0; end

In certain embodiments, the chipset memory controller of the computersystem uses the inherent behavioral characteristics of the memorydevices (e.g., DDR2 memory devices) to optimize throughput of the memorysystem. For example, for each internal bank in the memory array, a row(e.g., 1 KB page) is advantageously held activated for an extendedperiod of time. The memory controller, by anticipating a high number ofmemory accesses or hits to a particular region of memory, can exercisethis feature to advantageously eliminate time-consuming pre-chargecycles. In certain such embodiments in which two half-density memorydevices are transparently substituted for a single full-density memorydevice (as reported by the SPD device 240 to the memory controller), thememory devices advantageously support the “open row” feature.

FIG. 10A schematically illustrates an exemplary memory module 10 whichdoubles the rank density in accordance with certain embodimentsdescribed herein. The memory module 10 has a first memory capacity. Thememory module 10 comprises a plurality of substantially identical memorydevices 30 configured as a first rank 32 a and a second rank 32 b. Incertain embodiments, the memory devices 30 of the first rank 32 a areconfigured in pairs, and the memory devices 30 of the second rank 32 bare also configured in pairs. In certain embodiments, the memory devices30 of the first rank 32 a are configured with their respective DQS pinstied together and the memory devices 30 of the second rank 32 b areconfigured with their respective DQS pins tied together, as describedmore fully below. The memory module 10 further comprises a circuit 40which receives a first set of address and command signals from a memorycontroller (not shown) of the computer system. The first set of addressand command signals is compatible with a second memory capacitysubstantially equal to one-half of the first memory capacity. Thecircuit 40 translates the first set of address and command signals intoa second set of address and command signals which is compatible with thefirst memory capacity of the memory module 10 and which is transmittedto the first rank 32 a and the second rank 32 b.

The first rank 32 a of FIG. 10A has 18 memory devices 30 and the secondrank 32 b of FIG. 10A has 18 memory devices 30. Other numbers of memorydevices 30 in each of the ranks 32 a, 32 b are also compatible withembodiments described herein.

In the embodiment schematically illustrated by FIG. 10A, the memorymodule 10 has a width of 8 bytes (or 64 bits) and each of the memorydevices 30 of FIG. 10A has a bit width of 4 bits. The 4-bit-wide (“×4”)memory devices 30 of FIG. 10A have one-half the width, but twice thedepth of 8-bit-wide (“×8”) memory devices. Thus, each pair of “×4”memory devices 30 has the same density as a single “×8” memory device,and pairs of “×4” memory devices 30 can be used instead of individual“×8” memory devices to provide the memory density of the memory module10. For example, a pair of 512-Mb 128M×4-bit memory devices has the samememory density as a 1-Gb 128M×8-bit memory device.

For two “×4 ” memory devices 30 to work in tandem to mimic a “×8” memorydevice, the relative DQS pins of the two memory devices 30 in certainembodiments are advantageously tied together, as described more fullybelow. In addition, to access the memory density of a high-densitymemory module 10 comprising pairs of “×4” memory devices 30, anadditional address line is used. While a high-density memory modulecomprising individual “×8” memory devices with the next-higher densitywould also utilize an additional address line, the additional addresslines are different in the two memory module configurations.

For example, a 1-Gb 128M×8-bit DDR-1 DRAM memory device uses rowaddresses A₁₃-A₀ and column addresses A₁₁ and A₉-A₀. A pair of 512-Mb128M×4-bit DDR-1 DRAM memory devices uses row addresses A₁₂-A₀ andcolumn addresses A₁₂, A₁₁, and A₉-A₀. In certain embodiments, a memorycontroller of a computer system utilizing a 1-GB 128M×8 memory module 10comprising pairs of the 512-Mb 128M×4 memory devices 30 supplies theaddress and command signals including the extra row address (A₁₃) to thememory module 10. The circuit 40 receives the address and commandsignals from the memory controller and converts the extra row address(A₁₃) into an extra column address (A₁₂).

FIG. 10B schematically illustrates an exemplary circuit 40 compatiblewith embodiments described herein. The circuit 40 is used for a memorymodule 10 comprising pairs of “×4” memory devices 30 which mimicindividual “×8” memory devices. In certain embodiments, each pair hasthe respective DQS pins of the memory devices 30 tied together. Incertain embodiments, as schematically illustrated by FIG. 10B, thecircuit 40 comprises a programmable-logic device (PLD) 42, a firstmultiplexer 44 electrically coupled to the first rank 32 a of memorydevices 30, and a second multiplexer 46 electrically coupled to thesecond rank 32 b of memory devices 30. In certain embodiments, the PLD42 and the first and second multiplexers 44, 46 are discrete elements,while in other certain embodiments, they are integrated within a singleintegrated circuit. Persons skilled in the art can select an appropriatePLD 42, first multiplexer 44, and second multiplexer 46 in accordancewith embodiments described herein.

In the exemplary circuit 40 of FIG. 10B, during a row access procedure(CAS is high), the first multiplexer 44 passes the A₁₂ address throughto the first rank 32, the second multiplexer 46 passes the A₁₂ addressthrough to the second rank 34, and the PLD 42 saves or latches the A₁₃address from the memory controller. In certain embodiments, a copy ofthe A₁₃ address is saved by the PLD 42 for each of the internal banks(e.g., 4 internal banks) per memory device 30. During a subsequentcolumn access procedure (CAS is low), the first multiplexer 44 passesthe previously-saved A₁₃ address through to the first rank 32 a as theA₁₂ address and the second multiplexer 46 passes the previously-savedA₁₃ address through to the second rank 32 b as the A₁₂ address. Thefirst rank 32 a and the second rank 32 b thus interpret thepreviously-saved A₁₃ row address as the current A₁₂ column address. Inthis way, in certain embodiments, the circuit 40 translates the extrarow address into an extra column address in accordance with certainembodiments described herein.

Thus, by allowing two lower-density memory devices to be used ratherthan one higher-density memory device, certain embodiments describedherein provide the advantage of using lower-cost, lower-density memorydevices to build “next-generation” higher-density memory modules.Certain embodiments advantageously allow the use of lower-costreadily-available 512-Mb DDR-2 SDRAM devices to replace more expensive1-Gb DDR-2 SDRAM devices. Certain embodiments advantageously reduce thetotal cost of the resultant memory module.

FIG. 11A schematically illustrates an exemplary memory module 10 whichdoubles number of ranks in accordance with certain embodiments describedherein. The memory module 10 has a first plurality of memory locationswith a first memory density. The memory module 10 comprises a pluralityof substantially identical memory devices 30 configured as a first rank32 a, a second rank 32 b, a third rank 32 c, and a fourth rank 32 d. Thememory module 10 further comprises a circuit 40 which receives a firstset of address and command signals from a memory controller (not shown).The first set of address and command signals is compatible with a secondplurality of memory locations having a second memory density. The secondmemory density is substantially equal to one-half of the first memorydensity. The circuit 40 translates the first set of address and commandsignals into a second set of address and command signals which iscompatible with the first plurality of memory locations of the memorymodule 10 and which is transmitted to the first rank 32 a, the secondrank 32 b, the third rank 32 c, and the fourth rank 32 d.

Each rank 32 a, 32 b 32 c, 32 d of FIG. 11A has 9 memory devices 30.Other numbers of memory devices 30 in each of the ranks 32 a, 32 b, 32c, 32 d are also compatible with embodiments described herein.

In the embodiment schematically illustrated by FIG. 11A, the memorymodule 10 has a width of 8 bytes (or 64 bits) and each of the memorydevices 30 of FIG. 11A has a bit width of 8 bits. Because the memorymodule 10 has twice the number of 8-bit-wide (“×8”) memory devices 30 asdoes a standard 8-byte-wide memory module, the memory module 10 hastwice the density as does a standard 8-byte-wide memory module. Forexample, a 1-GB 128M×8-byte memory module with 36 512-Mb 128M×8-bitmemory devices (arranged in four ranks) has twice the memory density asa 512-Mb 128M×8-byte memory module with 18 512-Mb 128M×8-bit-memorydevices (arranged in two ranks).

To access the additional memory density of the high-density memorymodule 10, the two chip-select signals (CS₀, CS₁) are used with otheraddress and command signals to gate a set of four gated CAS signals. Forexample, to access the additional ranks of four-rank 1-GB 128M×8-byteDDR-1 DRAM memory module, the CS₀ and CS₁ signals along with the otheraddress and command signals are used to gate the CAS signalappropriately, as schematically illustrated by FIG. 11A. FIG. 11Bschematically illustrates an exemplary circuit 40 compatible withembodiments described herein. In certain embodiments, the circuit 40comprises a programmable-logic device (PLD) 42 and four “OR” logicelements 52, 54, 56, 58 electrically coupled to corresponding ranks 32a, 32 b, 32 c, 32 d of memory devices 30.

In certain embodiments, the PLD 42 comprises an ASIC, an FPGA, acustom-designed semiconductor device, or a CPLD. In certain embodiments,the PLD 42 and the four “OR” logic elements 52, 54, 56, 58 are discreteelements, while in other certain embodiments, they are integrated withina single integrated circuit. Persons skilled in the art can select anappropriate PLD 42 and appropriate “OR” logic elements 52, 54, 56, 58 inaccordance with embodiments described herein.

In the embodiment schematically illustrated by FIG. 11B, the PLD 42transmits each of the four “enabled CAS” (ENCAS₀a, ENCAS₀b, ENCAS₁a,ENCAS₁b) signals to a corresponding one of the “OR” logic elements 52,54, 56, 58. The CAS signal is also transmitted to each of the four “OR”logic elements 52, 54, 56, 58. The CAS signal and the “enabled CAS”signals are “low” true signals. By selectively activating each of thefour “enabled CAS” signals which are inputted into the four “OR” logicelements 52, 54, 56, 58, the PLD 42 is able to select which of the fourranks 32 a, 32 b, 32 c, 32 d is active.

In certain embodiments, the PLD 42 uses sequential and combinatoriallogic procedures to produce the gated CAS signals which are eachtransmitted to a corresponding one of the four ranks 32 a, 32 b, 32 c,32 d. In certain other embodiments, the PLD 42 instead uses sequentialand combinatorial logic procedures to produce four gated chip-selectsignals (e.g., CS₀a, CS₀b, CS₁a, and CS₁b) which are each transmitted toa corresponding one of the four ranks 32 a, 32 b, 32 c, 32 d.

Tied Data Strobe Signal Pins

For proper operation, the computer system advantageously recognizes a1-GB memory module comprising 256-Mb memory devices with 64M×4-bitconfiguration as a 1-GB memory module having 512-Mb memory devices with64M×8-bit configuration (e.g., as a 1-GB memory module with 128M×8-byteconfiguration). This advantageous result is desirably achieved incertain embodiments by electrically connecting together two outputsignal pins (e.g., DQS or data strobe pins) of the two 256-Mb memorydevices such that both output signal pins are concurrently active whenthe two memory devices are concurrently enabled. The DQS or data strobeis a bi-directional signal that is used during both read cycles andwrite cycles to validate or latch data. As used herein, the terms “tyingtogether” or “tied together” refer to a configuration in whichcorresponding pins (e.g., DQS pins) of two memory devices areelectrically connected together and are concurrently active when the twomemory devices are concurrently enabled (e.g., by a common chip-selector CS signal). Such a configuration is different from standard memorymodule configurations in which the output signal pins (e.g., DQS pins)of two memory devices are electrically coupled to the same source, butthese pins are not concurrently active since the memory devices are notconcurrently enabled. However, a general guideline of memory moduledesign warns against tying together two output signal pins in this way.

FIGS. 12 and 13 schematically illustrate a problem which may arise fromtying together two output signal pins. FIG. 12 schematically illustratesan exemplary memory module 305 in which a first DQS pin 312 of a firstmemory device 310 is electrically connected to a second DQS pin 322 of asecond memory device 320. The two DQS pins 312, 322 are bothelectrically connected to a memory controller 330.

FIG. 13 is an exemplary timing diagram of the voltages applied to thetwo DQS pins 312, 322 due to non-simultaneous switching. As illustratedby FIG. 13, at time t₁, both the first DQS pin 312 and the second DQSpin 322 are high, so no current flows between them. Similarly, at timet₄, both the first DQS pin 312 and the second DQS pin 322 are low, so nocurrent flows between them. However, for times between approximately t₂and approximately t₃, the first DQS pin 312 is low while the second DQSpin 322 is high. Under such conditions, a current will flow between thetwo DQS pins 312, 322. This condition in which one DQS pin is low whilethe other DQS pin is high can occur for fractions of a second (e.g., 0.8nanoseconds) during the dynamic random-access memory (DRAM) read cycle.During such conditions, the current flowing between the two DQS pins312, 322 can be substantial, resulting in heating of the memory devices310, 320, and contributing to the degradation of reliability andeventual failure of these memory devices.

A second problem may also arise from tying together two output signalpins. FIG. 14 schematically illustrates another exemplary memory module305 in which a first DQS pin 312 of a first memory device 310 iselectrically connected to a second DQS pin 322 of a second memory device320. The two DQS pins 312, 322 of FIG. 14 are both electricallyconnected to a memory controller (not shown). The DQ (data input/output)pin 314 of the first memory device 310 and the corresponding DQ pin 324of the second memory device 320 are each electrically connected to thememory controller by the DQ bus (not shown). Typically, each memorydevice 310, 320 will have a plurality of DQ pins (e.g., eight DQ pinsper memory device), but for simplicity, FIG. 14 only shows one DQ pinfor each memory device 310, 320.

Each of the memory devices 310, 320 of FIG. 14 utilizes a respectiveon-die termination or “ODT” circuit 332, 334 which has terminationresistors (e.g., 75 ohms) internal to the memory devices 310, 320 toprovide signal termination. Each memory device 310, 320 has acorresponding ODT signal pin 362, 364 which is electrically connected tothe memory controller via an ODT bus 340. The ODT signal pin 362 of thefirst memory device 310 receives a signal from the ODT bus 340 andprovides the signal to the ODT circuit 332 of the first memory device310. The ODT circuit 332 responds to the signal by selectively enablingor disabling the internal termination resistors 352, 356 of the firstmemory device 310. This behavior is shown schematically in FIG. 14 bythe switches 342, 344 which are either closed (dash-dot line) or opened(solid line). The ODT signal pin 364 of the second memory device 320receives a signal from the ODT bus 340 and provides the signal to theODT circuit 334 of the second memory device 320. The ODT circuit 334responds to the signal by selectively enabling or disabling the internaltermination resistors 354, 358 of the second memory device 320. Thisbehavior is shown schematically in FIG. 14 by the switches 346, 348which are either closed (dash-dot line) or opened (solid line). Theswitches 342, 344, 346, 348 of FIG. 14 are schematic representations ofthe operation of the ODT circuits 332, 334, and do not signify that theODT circuits 332, 334 necessarily include mechanical switches.

Examples of memory devices 310, 320 which include such ODT circuits 332,334 include, but are not limited to, DDR2 memory devices. Such memorydevices are configured to selectively enable or disable the terminationof the memory device in this way in response to signals applied to theODT signal pin of the memory device. For example, when the ODT signalpin 362 of the first memory device 310 is pulled high, the terminationresistors 352, 356 of the first memory device 310 are enabled. When theODT signal pin 362 of the first memory device 310 is pulled low (e.g.,grounded), the termination resistors 352, 356 of the first memory device310 are disabled. By selectively disabling the termination resistors ofan active memory device, while leaving the termination resistors ofinactive memory devices enabled, such configurations advantageouslypreserve signal strength on the active memory device while continuing toeliminate signal reflections at the bus-die interface of the inactivememory devices.

In certain configurations, as schematically illustrated by FIG. 14, theDQS pins 312, 322 of each memory device 310, 320 are selectivelyconnected to a voltage VTT through a corresponding termination resistor352, 354 internal to the corresponding memory device 310, 320.Similarly, in certain configurations, as schematically illustrated byFIG. 14, the DQ pins 314, 324 are selectively connected to a voltage VTTthrough a corresponding termination resistor 356, 358 internal to thecorresponding memory device 310, 320. In certain configurations, ratherthan being connected to a voltage VTT, the DQ pins 314, 324 and/or theDQS pins 312, 322 are selectively connected to ground through thecorresponding termination resistors 352, 354, 356, 358. The resistancesof the internal termination resistors 352, 354, 356, 358 are selected toclamp the voltages so as to reduce the signal reflections from thecorresponding pins. In the configuration schematically illustrated byFIG. 14, each internal termination resistor 352, 354, 356, 358 has aresistance of approximately 75 ohms.

When connecting the first memory device 310 and the second memory device320 together to form a double word width, both the first memory device310 and the second memory device 320 are, enabled at the sametime (egg.,by a common CS signal). Connecting the first memory device 310 and thesecond memory device 320 by tying the DQS pins 312, 322 together, asshown in FIG. 14, results in a reduced effective termination resistancefor the DQS pins 312, 322. For example, for the exemplary configurationof FIG. 14, the effective termination resistance for the DQS pins 312,322 is approximately 37.5 ohms, which is one-half the desired ODTresistance (for 75-ohm internal termination resistors) to reduce signalreflections since the internal termination resistors 352, 354 of the twomemory devices 310, 320 are connected in parallel. This reduction in thetermination resistance can result in signal reflections causing thememory device to malfunction.

FIG. 15 schematically illustrates an exemplary memory module 400 inaccordance with certain embodiments described herein. The memory module400 comprises a first memory device 410 having a first data strobe (DQS)pin 412 and a second memory device 420 having a second data strobe (DQS)pin 422. The memory module 400 further comprises a first resistor 430electrically coupled to the first DQS pin 412. The memory module 400further comprises a second resistor 440 electrically coupled to thesecond DQS pin 422 and to the first resistor 430. The first DQS pin 412is electrically coupled to the second DQS pin 422 through the firstresistor 430 and through the second resistor 440.

In certain embodiments, the memory module 400 is a 1-GB unbufferedDouble Data Rate (DDR) Synchronous Dynamic RAM (SDRAM) high-density dualin-line memory module (DIMM). FIGS. 16A and 16B schematically illustratea first side 462 and a second side 464, respectively, of such a memorymodule 400 with eighteen 64M×4-bit, DDR-1 SDRAM FBGA memory devices oneach side of a 184-pin glass-epoxy printed circuit board (PCB) 460. Incertain embodiments, the memory module 400 further comprises aphase-lock-loop (PLL) clock driver 470, an EEPROM for serial-presencedetect (SPD) data 480, and decoupling capacitors (not shown) mounted onthe PCB in parallel to suppress switching noise on VDD and VDDQ powersupply for DDR-1 SDRAM. By using synchronous design, such memory modules400 allow precise control of data transfer between the memory module 400and the system controller. Data transfer can take place on both edges ofthe DQS signal at various operating frequencies and programminglatencies. Therefore, certain such memory modules 400 are suitable for avariety of high-performance system applications.

In certain embodiments, the memory module 400 comprises a plurality ofmemory devices configured in pairs, each pair having a first memorydevice 410 and a second memory device 420. For example, in certainembodiments, a 128M×72-bit DDR SDRAM high-density memory module 400comprises thirty-six 64M×4-bit DDR-1 SDRAM integrated circuits in FBGApackages configured in eighteen pairs. The first memory device 410 ofeach pair has the first DQS pin 412 electrically coupled to the secondDQS pin 422 of the second memory device 420 of the pair. In addition,the first DQS pin 412 and the second DQS pin 422 are concurrently activewhen the first memory device 410 and the second memory device 420 areconcurrently enabled.

In certain embodiments, the first resistor 430 and the second resistor440 each has a resistance advantageously selected to reduce the currentflow between the first DQS pin 412 and the second DQS pin 422 whileallowing signals to propagate between the memory controller and the DQSpins 412, 422. In certain embodiments, each of the first resistor 430and the second resistor 440 has a resistance in a range betweenapproximately 5 ohms and approximately 50 ohms. For example, in certainembodiments, each of the first resistor 430 and the second resistor 440has a resistance of approximately 22 ohms. Other resistance values forthe first resistor 430 and the second resistor 440 are also compatiblewith embodiments described herein. In certain embodiments, the firstresistor 430 comprises a single resistor, while in other embodiments,the first resistor 430 comprises a plurality of resistors electricallycoupled together in series and/or in parallel. Similarly, in certainembodiments, the second resistor 440 comprises a single resistor, whilein other embodiments, the second resistor 440 comprises a plurality ofresistors electrically coupled together in series and/or in parallel.

FIGS. 17A and 17B schematically illustrate an exemplary embodiment of amemory module 400 in which the first resistor 430 and the secondresistor 440 are used to reduce the current flow between the first DQSpin 412 and the second DQS pin 422. As schematically illustrated by FIG.17A, the memory module 400 is part of a computer system 500 having amemory controller 510. The first resistor 430 has a resistance ofapproximately 22 ohms and the second resistor 440 has a resistance ofapproximately 22 ohms. The first resistor 430 and the second resistor440 are,electrically coupled in parallel to the memory controller 510through a signal line 520 having a resistance of approximately 25 ohms.The first resistor 430 and the second resistor 440 are also electricallycoupled in parallel to a source of a fixed termination voltage(identified by VTT in FIGS. 17A and 17B) by a signal line 540 having aresistance of approximately 47 ohms. Such an embodiment canadvantageously be used to allow two memory devices having lower bitwidths (e.g., 4-bit) to behave as a single virtual memory device havinga higher bit width (e.g., 8-bit).

FIG. 17B schematically illustrates exemplary current-limiting resistors430, 440 in conjunction with the impedances of the memory devices 410,420. During an exemplary portion of a data read operation, the memorycontroller 510 is in a high-impedance condition, the first memory device410 drives the first DQS pin 412 high (e.g., 2.7 volts), and the secondmemory device 420 drives the second DQS pin 422 low (e.g., 0 volts). Theamount of time for which this condition occurs is approximated by thetime between t₂ and t₃ of FIG. 13, which in certain embodiments isapproximately twice the tDQSQ (data strobe edge to output data edge skewtime, e.g., approximately 0.8 nanoseconds). At least a portion of thistime in certain embodiments is caused by simultaneous switching output(SSO) effects.

In certain embodiments, as schematically illustrated by FIG. 17B, theDQS driver of the first memory device 410 has a driver impedance R₁ ofapproximately 17 ohms, and the DQS driver of the second memory device420 has a driver impedance R₄ of approximately 17 ohms. Because theupper network of the first memory device 410 and the first resistor 430(with a resistance R₂ of approximately 22 ohms) is approximately equalto the lower network of the second memory device 420 and the secondresistor 440 (with a resistance R₃ of approximately 22 ohms), thevoltage at the midpoint is approximately 0.5*(2.7−0)=1.35 volts, whichequals VTT, such that the current flow across the 47-ohm resistor ofFIG. 17B is approximately zero.

The voltage at the second DQS pin 422 in FIG. 17B is given byV_(DQS2)=2.7*R₄/(R₁+R₂+R₃+R₄)=0.59 volts and the current flowing throughthe second DQS pin 422 is given by I_(DQS2)=0.59/R₄=34 milliamps. Thepower dissipation in the DQS driver of the second memory device 420 isthus P_(DQS2)=34 mA*0.59 V=20 milliwatts. In contrast, without the firstresistor 430 and the second resistor 440, only the 17-ohm impedances ofthe two memory devices 410, 420 would limit the current flow between thetwo DQS pins 412, 422, and the power dissipation in the DQS driver ofthe second memory device 420 would be approximately 107 milliwatts.Therefore, the first resistor 430 and the second resistor 440 of FIGS.17A and 17B advantageously limit the current flowing between the twomemory devices during the time that the DQS pin of one memory device isdriven high and the DQS pin of the other memory device is driven low.

In certain embodiments in which there is overshoot or undershoot of thevoltages, the amount of current flow can be higher than those expectedfor nominal voltage values. Therefore, in certain embodiments, theresistances of the first resistor 430 and the second resistor 440 areadvantageously selected to account for such overshoot/undershoot ofvoltages.

For certain such embodiments in which the voltage at the second DQS pin422 is V_(DQS2)=0.59 volts and the duration of the overdrive conditionis approximately 0.8 nanoseconds at maximum, the total surge isapproximately 0.59 V*1.2 ns=0.3 V-ns. For comparison, the JEDEC standardfor overshoot/undershoot is 2.4 V-ns, so certain embodiments describedherein advantageously keep the total surge within predeterminedstandards (e.g., JEDEC standards).

FIG. 18 schematically illustrates another exemplary memory module 600compatible with certain embodiments described herein. The memory module600 comprises a termination bus 605. The memory module 600 furthercomprises a first memory device 610 having a first data strobe pin 612,a first termination signal pin 614 electrically coupled to thetermination bus 605, a first termination circuit 616, and at least onedata pin 618. The first termination circuit 616 selectively electricallyterminating the first data strobe pin 612 and the first data pin 618 inresponse to a first signal received by the first termination signal pin614 from the termination bus 605. The memory module 600 furthercomprises a second memory device 620 having a second data strobe pin 622electrically coupled to the first data strobe pin 612, a secondtermination signal pin 624, a second termination circuit 626, and atleast one data pin 628. The second termination signal pin 624 iselectrically coupled to a voltage, wherein the second terminationcircuit 626 is responsive to the voltage by not terminating the seconddata strobe pin 622 or the second data pin 628. The memory module 600further comprises at least one termination assembly 630 having a thirdtermination signal pin 634, a third termination circuit 636, and atleast one termination pin 638 electrically coupled to the data pin 628of the second memory device 620. The third termination signal pin 634 iselectrically coupled to the termination bus 605. The third terminationcircuit 636 selectively electrically terminates the data pin 628 of thesecond memory device 620 through the termination pin 638 in response toa second signal received by the third termination signal pin 634 fromthe termination bus 605.

FIG. 19 schematically illustrates a particular embodiment of the memorymodule 600 schematically illustrated by FIG. 18. The memory module 600comprises an on-die termination (ODT) bus 605. The memory module 600comprises a first memory device 610 having a first data strobe (DQS) pin612, a first ODT signal pin 614 electrically coupled to the ODT bus 605,a first ODT circuit 616, and at least one data (DQ) pin 618. The firstODT circuit 616 selectively electrically terminates the first DQS pin612 and the DQ pin 618 of the first memory device 610 in response to anODT signal received by the first ODT signal pin 614 from the ODT bus605. This behavior of the first ODT circuit 616 is schematicallyillustrated in FIG. 14 by the switches 672, 676 which are selectivelyclosed (dash-dot line) or opened (solid line).

The memory module 600 further comprises a second memory device 620having a second DQS pin 622 electrically coupled to the first DQS pin612, a second ODT signal pin 624, a second ODT circuit 626, and at leastone DQ pin 628. The first DQS pin 612 and the second DQS pin 622 areconcurrently active when the first memory device 610 and the secondmemory device 620 are concurrently enabled. The second ODT signal pin624 is electrically coupled to a voltage (e.g., ground), wherein thesecond ODT circuit 626 is responsive to the voltage by not terminatingthe second DQS pin 622 or the second DQ pin 624. This behavior of thesecond ODT circuit 626 is schematically illustrated in FIG. 14 by theswitches 674, 678 which are opened.

The memory module 600 further comprises at least one terminationassembly 630 having a third ODT signal pin 634 electrically coupled tothe ODT bus 605, a third ODT circuit 636, and at least one terminationpin 638 electrically coupled to the DQ pin 628 of the second memorydevice 620. The third ODT circuit 636 selectively electricallyterminates the DQ pin 628 of the second memory device 620 through thetermination pin 638 in response to an ODT signal received by the thirdODT signal pin 634 from the ODT bus 605. This behavior of the third ODTcircuit 636 is schematically illustrated in FIG. 19 by the switch 680which is either closed (dash-dot line) or opened (solid line).

In certain embodiments, the termination assembly 630 comprises discreteelectrical components which are surface-mounted or embedded on theprinted-circuit board of the memory module 600. In certain otherembodiments, the termination assembly 630 comprises an integratedcircuit mounted on the printed-circuit board of the memory module 600.Persons skilled in the art can provide a termination assembly 630 inaccordance with embodiments described herein.

Certain embodiments of the memory module 600 schematically illustratedby FIG. 19 advantageously avoid the problem schematically illustrated byFIG. 12 of electrically connecting the internal termination resistancesof the DQS pins of the two memory devices in parallel. As describedabove in relation to FIG. 14, FIGS. 18 and 19 only show one DQ pin foreach memory device for simplicity. Other embodiments have a plurality ofDQ pins for each memory device. In certain embodiments, each of thefirst ODT circuit 616, the second ODT circuit 626, and the third ODTcircuit 636 are responsive to a high voltage or signal level by enablingthe corresponding termination resistors and are responsive to a lowvoltage or signal level (e.g., ground) by disabling the correspondingtermination resistors. In other embodiments, each of the first ODTcircuit 616, the second ODT circuit 626, and the third ODT circuit 636are responsive to a high voltage or signal level by disabling thecorresponding termination resistors and are responsive to a low voltageor signal level (e.g., ground) by enabling the corresponding terminationresistors. Furthermore, the switches 672, 674, 676, 678, 680 of FIG. 18are schematic representations of the enabling and disabling operation ofthe ODT circuits 616, 626, 636 and do not signify that the ODT circuits616, 626, 636 necessarily include mechanical switches.

The first ODT signal pin 614 of the first memory device 610 receives anODT signal from the ODT bus 605. In response to this ODT signal, thefirst ODT circuit 616 selectively enables or disables the terminationresistance for both the first DQS pin 612 and the DQ pin 618 of thefirst memory device 610. The second ODT signal pin 624 of the secondmemory device 620 is tied (e.g., directly hard-wired) to the voltage(e.g., ground), thereby disabling the internal termination resistors654, 658 on the second DQS pin 622 and the second DQ pin 628,respectively, of the second memory device 620 (schematically shown byopen switches 674, 678 in FIG. 19). The second DQS pin 622 iselectrically coupled to the first DQS pin 612, so the terminationresistance for both the first DQS pin 612 and the second DQS pin 622 isprovided by the termination resistor 652 internal to the first memorydevice 510.

The termination resistor 656 of the DQ pin 618 of the first memorydevice 610 is enabled or disabled by the ODT signal received by thefirst ODT signal pin 614 of the first memory device 610 from the ODT bus605. The termination resistance of the DQ pin 628 of the second memorydevice 620 is enabled or disabled by the ODT signal received by thethird ODT signal pin 634 of the termination assembly 630 which isexternal to the second memory device 620. Thus, in certain embodiments,the first ODT signal pin 614 and the third ODT signal pin 634 receivethe same ODT signal from the ODT bus 605, and the terminationresistances for both the first memory device 610 and the second memorydevice 620 are selectively enabled or disabled in response thereto whenthese memory devices are concurrently enabled. In this way, certainembodiments of the memory module 600 schematically illustrated by FIG.19 provides external or off-chip termination of the second memory device620.

Certain embodiments of the memory module 600 schematically illustratedby FIG. 19 advantageously allow the use of two lower-costreadily-available 512-Mb DDR-2 SDRAM devices to provide the capabilitiesof a more expensive 1-GB DDR-2 SDRAM device. Certain such embodimentsadvantageously reduce the total cost of the resultant memory module 600.

Certain embodiments described herein advantageously increase the memorycapacity or memory density per memory slot or socket on the system boardof the computer system. Certain embodiments advantageously allow forhigher memory capacity in systems with limited memory slots. Certainembodiments advantageously allow for flexibility in system board designby allowing the memory module 10 to be used with computer systemsdesigned for different numbers of ranks (e.g., either with computersystems designed for two-rank memory modules or with computer systemsdesigned for four-rank memory modules). Certain embodimentsadvantageously provide lower costs of board designs.

In certain embodiments, the memory density of a memory module isadvantageously doubled by providing twice as many memory devices aswould otherwise be provided. For example, pairs of lower-density memorydevices can be substituted for individual higher-density memory devicesto reduce costs or to increase performance. As another example, twicethe number of memory devices can be used to produce a higher-densitymemory configuration of the memory module. Each of these examples can belimited by the number of chip select signals which are available fromthe memory controller or by the size of the memory devices. Certainembodiments described herein advantageously provide a logic mechanism toovercome such limitations.

Various embodiments of the present invention have been described above.Although this invention has been described with reference to thesespecific embodiments, the descriptions are intended to be illustrativeof the invention and are not intended to be limiting. Variousmodifications and applications may occur to those skilled in the artwithout departing from the true spirit and scope of the invention.

1. A memory module comprising: a plurality of memory devices, eachmemory device having a corresponding load; and a circuit electricallycoupled to the plurality of memory devices and configured to beelectrically coupled to a memory controller of a computer system, thecircuit selectively isolating one or more of the loads of the memorydevices from the computer system, the circuit comprising logic whichtranslates between a system memory domain of the computer system and aphysical memory domain of the memory module.
 2. The memory module ofclaim 1, wherein the circuit comprises a logic element selected from agroup consisting of: a programmable-logic device (PLD), anapplication-specific integrated circuit (ASIC), a field-programmablegate array (FPGA), a custom-designed semiconductor device, and a complexprogrammable-logic device (CPLD).
 3. The memory module of claim 2,wherein the circuit further comprises one or more switches operativelycoupled to the logic element to receive control signals from the logicelement.
 4. The memory module of claim 1, wherein the plurality ofmemory devices has a first number of memory devices, and the circuitselectively isolates the loads of a second number of the memory devicesfrom the computer system, the second number less than the first number.5. The memory module of claim 4, wherein the first number of memorydevices are configured in a plurality of ranks, and wherein the secondnumber of memory devices are configured as one rank of the plurality ofranks.
 6. The memory module of claim 1, wherein the logic translatesaddress signals in the system memory domain to address signals in thephysical memory domain.
 7. The memory module of claim 1, wherein thesystem memory domain is compatible with a first number of chip selects,and the physical memory domain is compatible with a second number ofchip selects equal to twice the first number of chip selects.
 8. Thememory module of claim 1, wherein the system memory domain is compatibleto a first memory density, and the physical memory domain is compatiblewith a second memory density equal to twice the first memory density. 9.The memory module of claim 1, wherein the plurality of memory devicesare arranged in two or more ranks of memory devices.
 10. The memorymodule of claim 9, wherein the circuit comprises a data pathmultiplexer/demultiplexer which isolates the ranks of memory devicesfrom one another.
 11. The memory module of claim 1, wherein theplurality of memory devices comprises a pair of memory devices, eachmemory device of the pair having a first memory capacity, the pair ofmemory devices configured to simulate a memory device having a secondmemory capacity equal to twice the first memory capacity.
 12. The memorymodule of claim 1, wherein the memory module comprises a dual inlinememory module.
 13. The memory module of claim 12, wherein the memorymodule comprises a rank-buffered dual inline memory module.
 14. Thememory module of claim 1, wherein the memory module comprises a DDR 2SDRAM memory array.
 15. The memory module of claim 1, wherein thecircuit selectively isolates the loads of the memory devices from thecomputer system in response to a command or address signal received fromthe computer system.
 16. A method of using a memory module with acomputer system, the method comprising: providing a memory module havinga plurality of memory devices and a circuit electrically coupled to theplurality of memory devices, the circuit configured to be electricallycoupled to a computer system, each memory device having a correspondingload; electrically coupling the memory module to the computer system;and activating the circuit to selectively isolate at least one of theloads of the memory devices from the computer system and to translatebetween a system memory domain of the computer system and a physicalmemory domain of the memory module.
 17. The method of claim 16, whereinthe plurality of memory devices comprises a first number of memorydevices and activating the circuit selectively isolates the loads of asecond number of memory devices from the computer system, the secondnumber less than the first number.
 18. The method of claim 17, whereinthe first number of memory devices are arranged in two or more ranks ofmemory devices, and wherein the second number of memory devices arearranged as one rank of the two or more ranks.
 19. The method of claim18, wherein the circuit comprises a data path multiplexer/demultiplexerwhich isolates the ranks of memory devices from one another.
 20. Themethod of claim 16, wherein the plurality of memory devices comprises apair of memory devices, each memory device of the pair having a firstmemory capacity, the pair of memory devices configured to simulate amemory device having a second memory capacity equal to twice the firstmemory capacity.
 21. The method of claim 16, wherein the logictranslates address signals in the system memory domain to addresssignals in the physical memory domain.
 22. The method of claim 16,wherein the system memory domain is compatible with a first number ofchip selects, and the physical memory domain is compatible with a secondnumber of chip selects equal to twice the first number of chip selects.23. The method of claim 16, wherein the system memory domain iscompatible to a first memory density, and the physical memory domain iscompatible with a second memory density equal to twice the first memorydensity.
 24. The method of claim 16, wherein the memory module comprisesa dual inline memory module.
 25. A memory module connectable to acomputer system, the memory module comprising: a first memory devicehaving a first data signal line and a first data strobe signal line; asecond memory device having a second data signal line and a second datastrobe signal line; a common data signal line connectable to thecomputer system; and a device electrically coupled to the first datasignal line, to the second data signal line, and to the common datasignal line, the device selectively electrically coupling the first datasignal line to the common data signal line and selectively electricallycoupling the second data signal line to the common data signal line, thedevice comprising logic which translates between a system memory domainof the computer system and a physical memory domain of the memorymodule.
 26. The memory module of claim 25, wherein the device comprisesa logic element.
 27. The memory module of claim 26, wherein the devicefurther comprises one or more switches selectively electrically couplingthe first data signal line to the common data signal line andselectively electrically coupling the second data signal line to thecommon data signal line, the one or more switches operatively coupled tothe logic element to receive control signals from the logic element. 28.The memory module of claim 26, wherein the logic element is selectedfrom the group consisting of: an application-specific integratedcircuit, a custom-programmable logic device, and a field-programmablegate array.
 29. The memory module of claim 25, wherein the memory modulefurther comprises a common data strobe signal line connectable to thecomputer system, the device electrically coupled to the first datastrobe signal line, to the second data strobe signal line, and to thecommon data strobe signal line, the device selectively electricallycoupling the first data strobe signal line to the common data strobesignal line and selectively electrically coupling the second data strobesignal line to the common data strobe signal line.
 30. The memory moduleof claim 29, wherein the device comprises a logic element and one ormore switches selectively electrically coupling the first data strobesignal line to the common data strobe signal line and selectivelyelectrically coupling the second data strobe signal line to the commondata strobe signal line, the one or more switches operatively coupled tothe logic element to receive control signals from the logic element.